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2018 13th International Congress Molded Interconnect Devices : September 25-26 2018, Würzburg, Germany / IEEE Electronics Packaging Society.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Congress Molded Interconnect Devices (13th : 2018 : Würzburg, Germany)
- Language:
- English
- Subjects (All):
- Molded interconnect devices--Congresses.
- Molded interconnect devices.
- Three-dimensional display systems--Congresses.
- Three-dimensional display systems.
- Physical Description:
- 1 online resource (29 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed March 27, 2020).
- ISBN:
- 9781538649336
- 1538649330
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