1 option
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) / Institute of Electrical and Electronics Engineers Staff.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers Staff, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronics--Congresses.
- Microelectronics.
- Physical Description:
- 1 online resource
- Other Title:
- 2017 IMAPS Nordic Conference on Microelectronics Packaging
- Place of Publication:
- Piscataway, New Jersey : IEEE, 2017.
- Language Note:
- In English.
- Summary:
- The conference brings together both academics as well as industry leaders to discuss and debate the state of the art and future trends in microelectronics components, packaging, integration and manufacturing technologies.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-5386-3055-9
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.