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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging? : 25-28 October 2018, Iasi, Romania / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE International Symposium for Design and Technology in Electronic Packaging (24th : 2018 : Iasi, Romania)
- Language:
- English
- Subjects (All):
- Electronic packaging--Technological innovations--Congresses.
- Electronic packaging.
- Electronic apparatus and appliances--Congresses.
- Electronic apparatus and appliances.
- Electronic packaging--Design and construction--Congresses.
- Physical Description:
- 1 online resource (113 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed April 16, 2020).
- ISBN:
- 1-5386-5577-2
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