Advanced materials and components for 5G and beyond / Colin Tong.

Format:

Book

Author/Creator:

Tong, Xingcun Colin, author.

Series:

Springer series in materials science ; v. 327.

Springer series in materials science ; volume 327

Language:

English

Subjects (All):

5G mobile communication systems--Equipment and supplies.

5G mobile communication systems.

Genre:

Electronic books.

Physical Description:

1 online resource : illustrations (color).

Place of Publication:

Cham : Springer, 2022.

Summary:

This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for todays students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

Contents:

Chapter 1. 5G technology components and material solutions for hardware system integration

Chapter 2. Semiconductor solutions for 5G

Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits

Chapter 4. PCB materials and design requirements for 5G systems

Chapter 5. Materials for high frequency filters

Chapter 6. EMI shielding materials and absorbers for 5G communications

Chapter 7. Thermal management materials and components for 5G devices

Chapter 8. Protective packaging and sealing materials for 5G mobile devices

Chapter 9. Perspectives on 5G and beyond applications and related technologies.

Notes:

Includes bibliographical references and index.

Print version record.

Other Format:

Print version: Tong, Xingcun Colin. Advanced materials and components for 5G and beyond.

ISBN:

9783031172076

3031172078

OCLC:

1352870171

Access Restriction:

Restricted for use by site license.