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2022 IEEE Silicon Nanoelectronics Workshop (SNW) : 11-12 June 2022 / IEEE Silicon Nanoelectronics Workshop.
IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online
IEEE Xplore (IEEE/IET Electronic Library - IEL)- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE Silicon Nanoelectronics Workshop, author.
- Language:
- English
- Subjects (All):
- Silicon compounds--Congresses.
- Silicon compounds.
- Nanoelectronics--Congresses.
- Nanoelectronics.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2022 IEEE Silicon Nanoelectronics Workshop
- Place of Publication:
- Piscataway, New Jersey : IEEE, 2022.
- Summary:
- General coverage on nanometer scale devices and technologies that utilize silicon or which are based on novel materials on silicon substrates This is a sattelite workshop of EDS flagship conference 2022 IEEE Symposium on VLSI Technology and Circuits.
- Contents:
- Designing A Hybrid Variable Frequency Drive (VFD) with Active Magnetic Bearing (AMB) for Space Applications
- Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities
- Investigation of space charge accumulated in insulating materials of motor windings by applying voltage through an air gap
- A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics
- Thermomechanical analysis of Si-chip fracture caused by double-sided Ag sintering for PCB embedded package
- SiC MOSFET-Based High Performance Double Side Cooled Module and Compact Cooler for High Power-Density Automotive Inverter Applications
- High Temperature Dielectric and Electric Conduction Properties of Aluminium Nitride Substrates with Different Titanium Additions
- A PCB-based power converter for e-mobility applications
- Improved Drain-source Voltage Detection Method for Short-circuit Protection of SiC MOSFET
- An LTSpice - MATLAB Interface for Mitigating Convergence Problems in Circuit Optimization with SPICE
- Comparison of FEA Techniques for Estimation of Power Module Parasitics
- Design of a test package for high voltage SiC diodes
- Thermo-Mechanical Constraints for Packaging of Diamond Components
- Modeling Approach for Design Selection and Reliability Analysis of SiC Power Modules.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781665459792
- 1665459794
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