2 options
2022 IEEE/ACM International Conference on Technical Debt (TechDebt) / Institute of Electrical and Electronics Engineers (IEEE).
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers (IEEE), author, issuing body.
- Series:
- ACM Conferences
- Language:
- English
- Subjects (All):
- Computer software--Development--Congresses.
- Computer software.
- Computer software--Quality control--Congresses.
- Physical Description:
- 1 online resource (various pagings) : illustrations
- Other Title:
- 2022 IEEE/ACM International Conference on Technical Debt
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers (IEEE), 2022.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781450393041
- 1450393047
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