2022 International Conference on Electronics Packaging (ICEP) / Institute of Electrical and Electronics Engineers.

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Language:

English

Subjects (All):

Electronic packaging--Congresses.

Electronic packaging.

Physical Description:

1 online resource

Other Title:

2022 International Conference on Electronics Packaging

Place of Publication:

Piscataway, New Jersey : IEEE, 2022.

Summary:

ICEP is counted as one of the largest Asian international conferences on electronic packaging, attracting more than 360 attendees and hosting over 35 technical sessions every year since 2001 The conference scope is to share the cutting edge of electronic packaging technologies such as Advanced Packaging, Design, Modeling, and Reliability, Interconnections, Materials & Processing, Optoelectronics, Power Electronics, Thermal Management, Highspeed, Wireless & Components, Emerging Technologies, and Other Upcoming Technologies Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world renowned experts in all aspects related to packaging technologies from all over the world.

Notes:

Description based on online resource; title from PDF title page (IEEE, viewed April 24, 2023).

ISBN:

4-9911911-3-0