Lead-free soldering process development and reliability / edited by Jasbir Bath.

Format:

Book

Contributor:

Bath, Jasbir, editor.

Series:

Wiley series in quality & reliability engineering.

Wiley Series in Quality & Reliability Engineering

Language:

English

Subjects (All):

Electronic packaging.

Solder and soldering.

Physical Description:

1 online resource (515 pages).

Place of Publication:

Hoboken, New Jersey : Wiley, 2020.

Summary:

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Notes:

Includes bibliographical references and index.

Description based on print version record.

ISBN:

1-119-48204-6

1-119-48209-7