Photomask technology 2021 / edited by Stephen P. Renwick.

Format:

Book

Contributor:

Renwick, Stephen P., editor.

Series:

Proceedings of SPIE--the International Society for Optical Engineering ; Volume 11855.

Proceedings of SPIE ; Volume 11855

Language:

English

Subjects (All):

Integrated circuits--Masks--Congresses.

Integrated circuits.

Physical Description:

1 online resource

Place of Publication:

Bellingham, Washington : SPIE, [2021]

Contents:

Contacts and lines SEM image metrology with SMILE / Author(s): Iacopo Mochi; Michaela Vockenhuber; Timothée Allenet; Yasin Ekinci

3D-MC modelling of particle contamination induced defects in ebeam mask writing / Author(s): Jan Klikovits; Robert Polster; Ulrich Hofmann; Axel Feicke; Timo Wandel

High-precision and cost-effective EUV reticle defect registration with integrated grid matching using KLA LMS IPRO and FlashScan / Author(s): P. Y. Portnichenko; F. Oezdogan; L. Dawahre; O. Lohse; B. Kalsbeck; P. Jain; H. Steigerwald; S. Ismail; F. Laske

SEM image quality assessment for mask quality control / Author(s): Nivea G. Schuch; Alexandre Moly; Charles Valade; Nassim Halli; Mohamed Abaidi; Jordan Belissard; Frederic Robert; Thiago Figueiro

Resolution limit and photon flux dependency in EUV ptychography / Author(s): H. Kim; R. Nebling; A. Dejkameh; S. Tao; I. Mochi; Y. Ekinci

Subpixel pattern edge placement controllability of digital scanner / Author(s): Yuho Kanaya; Yoji Watanabe; Yusuke Saito; Toshiaki Sakamoto; Soichi Owa; Noriyuki Hirayanagi; Thomas Koo; Craig Poppe; David Tseng; Conrad Sorensen; Hwan Lee; Stephen Renwick; Bausan Yuan

Nanoimprint lithography methods for achieving sub-3nm overlay / Author(s): Kenji Yamamoto; Hideyuki Wada; Yoshio Suzaki; Kazuhiro Sato; Satoshi Iino; Satoru Jimbo; Osamu Morimoto; Mitsuru Hiura; Nilabh Roy; Anshuman Cherala; Jin Choi

Study for big data interrelation using real-time monitoring technology in high cost, high volume manufacturing EUV era / Author(s): Hyun-Joo Lee Sr.; Euihyun Jung; Daein Kim; Byoungsu Kim; Seun Yang; Jaewhan Sung; Joonsoo Park

Lithography printability review: the ultimate step in reticle analyzer to avoid killer mask defects in wafer fab manufacturing / Author(s): Frank CM Wu; Chin Kuei Chang; Chain Ping Chen; Dongmei Wu; Wei Chen; Jinhua Zeng; Suo Li; Le Wang; Vikram Tolani

Study of high throughput EUV mask pattern inspection technologies using multi e-beam optics / Author(s): Tadayuki Sugimori; Riki Ogawa; Hidekazu Takekoshi; John G. Hartley; David J. Pinkney; Atsushi Ando; Koichi Ishii; Chosaku Noda; Nobutaka Kikuiri

An SEM-based deep defect classification system for VSB mask writer that works with die-to-die and die-to-database inspection methods using multiple digital twins built with the state-of-the-art neural networks / Author(s): Ajay K. Baranwal; Suhas Pillai; Thang Nguyen; Jun Yashima; Jim DeWitt; Noriaki Nakayamada; Aki Fujimura

Characterization of mask CD mean-to-target for hotspot patterns by using SEM image contours / Author(s): Kan Zhou; Xin Guo; Yinsheng Yu; Hongwen Zhao; Wenzhan Zhou; Yu Zhang; Ao Chen; Wenming Wu; Qijian Wan; Huaiyang Dou; Chunshan Du; Liguo Zhang; Germain Fenger

A customized multifunctional actinic tool for EUV industry / Author(s): Byung Gook Kim

EMA modelled alternative EUV absorber materials considering optical and stability behavior / Author(s): Rajiv N. Sejpal; Bruce W. Smith

An EUV photomask cleaning solution for the removal of tin contaminate / Author(s): Pen-Nan Liao; Bryan Barton

The semiconductor world of the 2020s according to photomasks: how semiconductor growth depends upon solving photomask market challenges / Author(s): Bud Caverly; Les Dahl; Franklin Kalk

A general formula for deep learning success in semiconductor manufacturing / Author(s): Aki Fujimura; Ajay Baranwal

Lithography tool improvement at productivity and performance with data analysis and machine learning / Author(s): Takahiro Takiguchi; Yosuke Takarada; Tsuneari Fukada; Satoru Sugiyama; Keiji Yoshimura

Litho-aware redundant local-loop insertion framework with convolutional neural network / Author(s): Tong Qu; Yibo Lin; Tianyang Gai; Xiaojing Su; Shuhan Wang; Bojie Ma; Yajuan Su; Yayi Wei

Uncertainty quantification of machine learning models: on conformal prediction / Author(s): Inimfon I. Akpabio; Serap A. Savari

EUV attenuated phase shift mask: development and characterization of mask properties / Author(s): Ikuya Fukasawa; Yohei Ikebe; Takeshi Aizawa; Tsutomu Shoki; Takahiro Onoue

Precision phase angle control with transmissive etching stop film / Author(s): Hiroaki Shishido; Osamu Nozawa; Ryo Ohkubo; Hitoshi Maeda; Masahiro Hashimoto

Optimal phase shift and reflectance for high numerical aperture EUV phase shift mask / Author(s): In-Hwa Kang; Jang-Gun Park; Min-Woo Kim; Jun-Hyeong Lee; Hye-Keun Oh

Using curvature-based pre-bias to reduce number of iterations in curvilinear mask process correction / Author(s): Zhiheng (Mary) Zuo; Malavika Sharma; Ingo Bork; Bhardwaj Durvasula; Peter Buck

Curvature based fragmentation for curvilinear mask process correction / Author(s): Ingo Bork; Peter Buck; Bhardwaj Durvasula; Vlad Liubich; Nageswara Rao; Rachit Sharma; Mary Zuo

Rapid full-chip curvilinear OPC for advanced logic and memory / Author(s): Vlad Liubich; Keisuke Mizuuchi; Alexander Tritchkov; Ashutosh Rathi; Xima Zhang; Isabella Kim; John Sturtevant

Optimizing curvilinear ILT recipe development with machine learning based pattern selection / Author(s): Yuansheng Ma; Rui Wu; Junjiang Lei; Keisuke Mizuuchi; Alexander Tritchkov; Fan Jiang; Dingyi Hong; Rehab Ali; Le Hong; Yuyang Sun

Curvilinear masks: an overview / Author(s): Yohan Choi; Aki Fujimura; Abhishek Shendre

Benefits of an integrated pipelined flow for curvilinear MPC and multibeam fracture / Author(s): Apurva Bajpai; Rachit Sharma; Amanda Bowhill; Stephen Kim; Soohong Kim

Multi-beam mask writer MBM-2000 / Author(s): Hiroshi Matsumoto; Keisuke Yamaguchi; Hayato Kimura; Noriaki Nakayamada

Study on modeling of resist surface charge effect on mask blanks with charge dissipation layer in electron beam mask writers / Author(s): Haruyuki Nomura; Noriaki Nakayamada; Takashi Kamikubo; Reiko Nishimura; Rumi Ito; Yoshinori Kojima

Acceleration method for source mask optimization at 7nm technology node / Author(s): Xiaojing Su; Lisong Dong; Yunyun Hao; Yajuan Su; Yayi Wei

Sensitivity analysis based SEM measurement down-sampling approach for mask process modeling applications / Author(s): Kushlendra Mishra; Rachit Sharma; Ingo Bork; Peter Buck; Dongeun Cha; Seungheon Na; Jaekwang Kim; Kiwook Park; Inpyo Kim

Redefining innovation during The Renaissance of Computing / Author(s): Christine C. Dunbar

A new generation cost-efficient laser mask writer, addressable up to the 90nm node / Author(s): Robert Eklund; Mats Rosling; Mikael Wahlsten; Martin Glimtoft; Göran Hansson; Anders Svensson; Youngjin Park

File formats for curvilinear multi-beam writing of 193i and EUV masks / Author(s): Christof Zillner; Amir Moqanaki; Harald Höller; Elmar Platzgummer; Masakazu Hamaji; Taigo Fujii

Statistical analysis of the impact of 2D reticle variability on wafer variability in advanced EUV nodes using large-scale Monte Carlo simulations / Author(s): Luke T. Long; Adam Lyons; Tom Wallow

Panel Discussion: Mask readiness for 3nm and beyond: a mask supplier's perspective / Author(s): Bryan S. Kasprowicz; Emily E. Gallagher; Andrew Wall; Lawrence S. Melvin III; Masashi Sunako; Tilmann Heil.

Notes:

Description based on: online resource; title from PDF information screen (SPIE, viewed March 30, 2023).

ISBN:

1-5106-4555-1