International Symposium on Advanced Materials and Processing 2021 (ISAMP 2021) / Hui Lin Ong.

Format:

Book

Author/Creator:

Ong, Hui Lin, author.

Series:

American Institute of Physics

Language:

English

Subjects (All):

Materials--Congresses.

Materials.

Physical Description:

1 online resource (130 pages).

Other Title:

INTERNATIONAL SYMPOSIUM ON ADVANCED MATERIALS AND PROCESSING 2021

Place of Publication:

Melville, New York : AIP Publishing, 2021.

Summary:

The International Symposium of Advanced Materials and Processing (ISAMP 2021) was the first conference organized by the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP) in conjunction with the International Multidisciplinary Conference (IMC 2021). The ISAMP 2021 was held virtually on 13th July 2021, due to the COVID-19 pandemic. The ISAMP 2021 is aimed to bring together the academics and leading researchers from diverse background and area in materials, mechanical & manufacturing and chemical disciplines. This proceeding contents articles that describe the state-of-art of the research fields mainly related to materials science and engineering. Specific research topics like mechanical and manufacturing; recycling materials and processes; chemical science and engineering; advanced conductive materials and devices; and environment and green technology materials are also included.

Notes:

Description based on online resource; title from PDF title page (AIP Publishing, viewed May 1, 2023).