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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Systems engineering.
- Physical Description:
- 1 online resource
- Other Title:
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2022.
- Notes:
- Description based on: online resource; title from PDF information screen (Worldcat, viewed April 21, 2023).
- ISBN:
- 1-66545-836-4
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