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2021 IEEE/ACM International Conference on Technical Debt : TechDebt 2021 : proceedings : 22-30 May 2021 / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Computer software--Development--Congresses.
- Computer software.
- Computer software--Quality control--Congresses.
- Software engineering--Congresses.
- Software engineering.
- Physical Description:
- 1 online resource (xii, 115 pages) : illustrations
- Other Title:
- 2021 IEEE/ACM International Conference on Technical Debt
- Place of Publication:
- Piscataway, New Jersey : IEEE, [2021]
- Summary:
- The goal of BoKSS 2021 is to create such a knowledge base We seek to create a knowledge base of actionable results that will transform sustainable software engineering practices from a novel research area into a robust, repeatable, teachable practice area within software engineering.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-66541-405-7
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