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2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (xix, 391 pages)
- Other Title:
- 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2021.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-66542-110-X
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