Wafer manufacturing : shaping of single crystal silicon wafers / Imin Kao, Chunhui Chung.

Format:

Book

Author/Creator:

Kao, Imin, author.

Chung, Chunhui, author.

Language:

English

Subjects (All):

Semiconductor wafers--Design and construction.

Semiconductor wafers.

Physical Description:

1 online resource (307 pages) : illustrations

Edition:

First edition.

Place of Publication:

Hoboken, New Jersey : John Wiley & Sons, Incorporated, [2021]

Summary:

"A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."-- Provided by publisher.

Notes:

Description based on print version record.

Includes index.

ISBN:

9781118696255

1118696255

9781118696231

1118696239

9781118696224

1118696220

OCLC:

1183400300