SiC power module design performance, robustness and reliability edited by Alberto Castellazzi and Andrea Irace

Format:

Book

Contributor:

Castellazzi, Alberto, editor.

Irace, Andrea, editor.

Series:

IET energy engineering series 151

IET energy engineering 151

Language:

English

Subjects (All):

Wide gap semiconductors.

Silicon carbide.

Physical Description:

1 online resource

Place of Publication:

London, United Kingdom The Institution of Engineering and Technology 2021

Summary:

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes

Contents:

Preface

1. SiC power MOSFETs and their application / Alberto Castellazzi and Andrea Irace

2. Anatomy of a multi-chip power module / Cyrille Duchesne, Philippe Lasserre, and Emmanuel Batista

3. Established module design and transfer to SiC technology / Katsuaki Saito

4. Temperature-dependent modeling of SiC power MOSFETs for within- and out-of-SOA simulations / Vincenzo d'Alessandro, Michele Riccio, and Andrea Irace

5. Optimum module design I: electrothermal / Antonio Pio Catalano, Ciro Scognamillo, Vincenzo d'Alessandro, and Lorenzo Codecasa

6. Optimum module design II: impact of parameter design spread / Michele Riccio, Alessandro Borghese, Vincenzo d'Alessandro, Luca Maresca, and Andrea Irace

7. Optimum module design III: Electromagnetic / Cyrille Duchesne, Philippe Lasserre, and Emmanuel Batista / 8. Power module lifetime evaluation methodologies / Noriyuki Miyazaki, Nobuyuki Shishido, and Yutaka Hayama

9. High-temperature capable SiC power modules by Ag sintering on various metal interfaces / Chuantong Chen and Katsuaki suganuma

10. Advanced die-attach validation technologies / Keisuke Wakamoto, Ryosuke Matsumoto, and Takahiro Namazu

11. Power module degradation monitoring / Attahir Murtala Aliyu and Alberto Castellazzi

12. Advanced thermal management solutions / Xiang Wang and Alberto Castellazzi

13. Emerging packaging concepts and technologies / Emre Gurpinar and Burak Ozpineci

Other Format:

Print version SiC power module design

ISBN:

178561908X

9781785619083

OCLC:

1283860133

Access Restriction:

Restricted for use by site license