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Development of sub-mm wave flip-chip interconnect / Sirinpa Monayakul.
- Format:
- Book
- Author/Creator:
- Monayakul, Sirinpa, author.
- Series:
- Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik ; Band 38
- Language:
- English
- Subjects (All):
- Gold alloys.
- Eutectic alloys.
- Flip chip technology.
- Physical Description:
- 1 online resource (142 pages) : illustrations (some color).
- Edition:
- 1st edition.
- Place of Publication:
- Gottingen, Germany : Cuvillier Verlag, 2016.
- Summary:
- With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz. Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
- Notes:
- Includes bibliographical references.
- Description based on online resource; title from PDF title page (ebrary, viewed September 27, 2017).
- ISBN:
- 9783736984103
- 3736984103
- OCLC:
- 1003262196
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