Semiconductor advanced packaging / John H. Lau.

Format:

Book

Author/Creator:

Lau, John H., author.

Language:

English

Subjects (All):

Semiconductors--Design and construction.

Semiconductors.

Physical Description:

1 online resource (XXII, 498 p. 557 illus., 530 illus. in color.)

Edition:

1st ed. 2021.

Place of Publication:

Gateway East, Singapore : Springer, [2021]

Summary:

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Contents:

Recent Advance on Semiconductor Packaging

System-in-Package

Fan-In Wafer/Panel-Level Chip-Scale Packages

Fan-Out Wafer/Panel-Level Packaging

2D, 2.1D, and 2.3D IC Integration

2.5D IC Integration

3D IC Integration

Hybrid Bonding

Chiplets Packaging

Dielectric Materials

Trends and Roadmap for Advanced Semiconductor Packaging.

Notes:

Includes bibliographical references and index.

Description based on print version record.

ISBN:

981-16-1376-1

OCLC:

1252421476