Wireless interface technologies for 3D IC and module integration / Tadahiro Kuroda, University of Tokyo, Wai-Yeung Yip, University of Tokyo.

Format:

Book

Author/Creator:

Kuroda, Tadahiro, author.

Yip, Wai-Yeung, author.

Language:

English

Subjects (All):

Interconnects (Integrated circuit technology).

Optical interconnects.

Three-dimensional integrated circuits.

Physical Description:

1 online resource (xii, 323 pages) : digital, PDF file(s).

Place of Publication:

Cambridge : Cambridge University Press, 2021.

Summary:

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Notes:

Title from publisher's bibliographic system (viewed on 21 Sep 2021).

ISBN:

1-108-89822-X

1-108-89329-5

OCLC:

1263247229