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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Microelectronics--Congresses.
- Microelectronics.
- Physical Description:
- 1 online resource
- Other Title:
- 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- Place of Publication:
- Piscataway, New Jersey : IEEE, 2020.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781728160498
- 1728160499
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