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2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) / Institute of Electrical and Electronics Engineers (IEEE).
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers (IEEE), author, issuing body.
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Micromachining--Congresses.
- Micromachining.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers (IEEE), 2020.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-7281-8901-2
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