2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) / Institute of Electrical and Electronics Engineers.

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Language:

English

Subjects (All):

Electronic packaging--Congresses.

Electronic packaging.

Physical Description:

1 online resource (138 pages)

Other Title:

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems

Place of Publication:

[Place of publication not identified] : Institute of Electrical and Electronics Engineers, 2019.

Language Note:

In English.

Summary:

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

Notes:

Description based on publisher supplied metadata and other sources.

ISBN:

1-7281-4585-6