Newnes electronics assembly handbook / Keith Brindley.

Format:

Book

Author/Creator:

Brindley, Keith, author.

Language:

English

Subjects (All):

Electronic apparatus and appliances--Design and construction.

Electronic apparatus and appliances.

Printed circuits--Design and construction.

Printed circuits.

Surface mount technology.

Electronic packaging.

Physical Description:

1 online resource (354 p.)

Place of Publication:

Oxford : Heinemann Newnes, 1990.

Language Note:

English

Summary:

Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are des

Contents:

Front Cover; Newnes Electronics Assembly Handbook; Copyright Page; Table of Contents; Preface; Chapter 1. Introduction; Bringing together varied disciplines; Applications; Standardization; Book layout and description; Chapter 2. Electronics assembly: the PCB; The printed circuit board; Base materials; Basic mechanical properties; PCB manufacture; PCB manufacturing processes; Design; Layout; Through-hole PCB assembly; Testing; Cleaning of assemblies; Conformal coatings; Total automatic assembly; Chapter 3. Electronics assembly: the SMA; Surface mounted assemblies; Advantages and disadvantages

Surface mounted componentsBase materials; Thermal design of surface mounted assemblies; Design; Assembly; Assembly variations; Testing assemblies; Component placement; References; Chapter 4. Electromechanical assembly: packaging; Packaging engineering; Adhesives; Thermal management; Environmental considerations; Electromagnetic compatability; References; Chapter 5. Soldering; Changing face; Requirements of the soldering process; Solderability and protective coatings; Soldering processes; Solder; Flux; Types of joints; Solder resists; Hand soldering; Mass CS soldering - wave soldering

Mass SC reflow solderingComparison of soldering processes; Cleaning of PCBs; References; Chapter 6. Testing for quality; The philosophy of quality; Reliability; Component parts testing; Production processes; The unpackaged assembly; The packaged assembly; References; Chapter 7. Standardization of electronics manufacture: quality assurance; Standards; Reference to standards; Levels of standards; Standards organizations and bodies; The work of BSI; BSS; Assessed capability of companies; Assessed quality of components; Setting up company standards; References

Chapter 8. Selling to the Ministry of DefenceMoD organization; Procurement executive; Procurement executive policy and procedures; Quality assurance; Glossary; Appendix 1: Worldwide standards; Guide to relevant worldwide standards, by subject; Guide to relevant worldwide standards, by reference; Appendix 2: Worldwide addresses; UK Governmental Departments; Institutions and associations; Standards organizations and bodies; Appendix 3: Further reading; Index

Notes:

Description based upon print version of record.

Includes bibliographical references (pages [341]-343) and index.

Description based on print version record.

ISBN:

9781483102511

1483102513

OCLC:

931874482