Heterogeneous optoelectronics integration : proceedings of a conference held 25 January 2000, San Jose, California / Elias Towe, editor ; sponsored by SPIE-The International Society for Optical Engineering.

Format:

Book

Contributor:

Towe, Elias, editor.

Society of Photo-Optical Instrumentation Engineers, publisher.

Series:

SPIE monograph ; PM89.

SPIE digital library

SPIE Press monograph ; PM89

Language:

English

Subjects (All):

Integrated optics--Congresses.

Integrated optics.

Optoelectronic devices--Design and construction--Congresses.

Optoelectronic devices.

Optoelectronic devices--Design and construction.

Integrated circuits--Very large scale integration--Congresses.

Integrated circuits.

Integrated circuits--Very large scale integration.

Genre:

Electronic books.

Conference papers and proceedings.

Physical Description:

1 online resource (xii, 281 pages) : illustrations.

Place of Publication:

Bellingham, WA : SPIE Optical Engineering Press, 2000.

Bellingham, Wash., USA : SPIE Press, 2019.

System Details:

Mode of access: World Wide Web.

text file

Summary:

Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.

Contents:

Preface

Chapter 1. Monolithic and heterogeneous optoelectronic integration: the epitaxy-on-electronics, silicon-on-gallium arsenide, and aligned-pillar-bonding techniques / Clifton G. Fonstad, Jr.: 1.1. Introduction; 1.2. Hybrid, monolithic, and psuedomonolithic integration; 1.3. Materials issues in integration; 1.4. Gallium arsenide-on-silicon; 1.5. Epitaxy-on-electronics; 1.6. Silicon-on-gallium arsenide; 1.7. Aligned-pillar bonding; 1.8. Conclusion and acknowledgements; References

Chapter 2. Vertical-cavity surface-emitting lasers specifically designed for integration with electronic circuits / Leon M. F. Chirovsky, Ashok V. Krishnamoorthy, William S. Hobson, John Lopata, Keith W. Goossen, and L. Arthur D'Asaro: 2.1. Motivation for the work; 2.2. Background information; 2.3. Detailed description of an I2-VCSEL, the first implementation of the P2I2-VCSEL design strategy; 2.4. Data on the first, top-emitting I2-VCSELs; 2.5. Data on bottom-emitting and on hybrid-integrated I2-VCSELs; 2.6. Design modifications for high-speed P2I2-VCSELs; 2.7. Data on high-speed P2I2-VCSELs and its analysis; 2.8. Conclusion; Acknowledgements; References

Chapter 3. Heterogeneous integration of vertical-cavity surface-emitting laser arrays to CMOS integrated circuits / Carl W. Wilmsen and Rui Pu: 3.1. Introduction; 3.2. General Discussion of Possible Methods of Bonding VCSELs to CMOS; 3.3. Review of heterogeneous integration of VCSELs and electronic circuits; 3.4. Overview and details of bonding techniques; 3.5. Electrical and optical characteristics; 3.6. Thermal characteristics; 3.7. Comparison of these results with other methods and appraisal of these techniques; 3.8. Applications; 3.9. Summary; Acknowledgements; References

Chapter 4. Heterogeneous and monolithic integration for optical interconnects / Duane A. Louderback, Larry A. Coldren, Ola Sjölund, Eric R. Hegblom, Eva M. Strzelecka, Shigeru Nakagawa, Syn-Yem Hu, Dan D. Lofgreen, Ryan L. Naone, Jack Ko: 4.1. Introduction; 4.2. Scaling VCSEL performance: small, high-performance VCSELs; 4.3. Monolithic refractive microlenses; 4.4. Monolithically integrated VCSELs and detectors with microlenses; 4.5. WDM pie-shaped VCSEL arrays; 4.6. Summary; References

Chapter 5. Large-scale heterogeneous optoelectronic integration / John A. Trezza, Jeffry Powell, Richard J. Williams, Ronald J. Olson, Mani Sundaram, Keith Kang: 5.1 Introduction to very-large-scale heterogeneous integration; 5.2 Devices and device-integration techniques; 5.3 Applications; 5.4 Summary; References

Chapter 6. Molded integration of optical, optoelectronic and electronic components / Volkan H. Ozguz and John C. Carson: 6.1. Introduction; 6.2. Description of the developed molding technique; 6.3. Application to optoelectronic integration; 6.4. Future development, system applications and conclusions; Acknowledgements; References

Chapter 7. Scalable micro-optical modules for short distance VLSI-photonic interconnections / Hugo Thienpont, Valerie Baukens, Christof Debaes, Heidi Ottevaere, Pedro Vynck, Patrik Tuteleers, Guy Verschaffelt, Bart Volckaerts, Alex Hermanne, Mike Hanney, Marnik Brunfaut, Jan Van Campenhout, Irina Veretennicoff: 7.1. Introduction and rationale; 7.2. The concept; 7.3. Design of the optical bridge; 7.4. Fabrication with deep proton lithography; 7.5. Proof-of-principle demonstration; 7.6. Mass-Fabrication and tolerances; 7.7. Conclusion; Acknowledgements; References.

Notes:

"SPIE Digital Library."--Website.

Includes bibliographical references and index.

Title from PDF title page (SPIE eBooks Website, viewed 2019-06-11).

Other Format:

Print version

ISBN:

9781510627727

OCLC:

1104952661

Access Restriction:

Restricted for use by site license.