Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA

Format:

Book

Contributor:

Tanner, Danelle Mary, Contributor.

Ramesham, Rajeshuni, Contributor.

Society of Photo-Optical Instrumentation Engineers, Content Provider.

Sandia National Laboratories, Content Provider.

Semiconductor Equipment and Materials International, Content Provider.

Solid State Technology (Organization), Content Provider.

Series:

SPIE proceedings series Reliability, packaging, testing, and characterization of MEMS/MOEMS IV

Language:

English

Subjects (All):

Microelectromechanical systems--Reliability--Congresses.

Microelectromechanical systems.

Microelectromechanical systems--Testing--Congresses.

Other Title:

Reliability, testing and characterization of MEMS/MOEMS.

Place of Publication:

[Place of publication not identified] SPIE 2005

Language Note:

English

Notes:

Bibliographic Level Mode of Issuance: Monograph