1 option
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X : 24-25 January 2011, San Francisco, California, United States
- Format:
- Book
- Series:
- Proceedings of SPIE Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Reliability--Congresses.
- Microelectromechanical systems.
- Microelectromechanical systems--Testing--Congresses.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Place of Publication:
- [Place of publication not identified] SPIE 2011
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.