1 option
Photonics packaging and integration III : 28-30 January, 2003, San Jose, California, USA
- Format:
- Book
- Series:
- SPIE proceedings series Photonics packaging and integration III
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Photonics--Congresses.
- Photonics.
- Place of Publication:
- [Place of publication not identified] SPIE 2003
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.