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Copper interconnect technology / Christoph Steinbruche, Barry Chin.
- Format:
- Book
- Author/Creator:
- Steinbruchel, Christoph, author.
- Chin, Barry, author.
- Series:
- Tutorial texts in optical engineering ; TT46.
- SPIE digital library
- Tutorial texts in optical engineering ; v. TT46
- Language:
- English
- Subjects (All):
- Electronic packaging.
- Semiconductors--Junctions.
- Semiconductors.
- Microelectronic packaging.
- Copper.
- Genre:
- Electronic books.
- Physical Description:
- 1 online resource (viii, 122 pages) : illustrations.
- Place of Publication:
- Bellingham, Washington : SPIE Optical Engineering Press, 2001.
- System Details:
- Mode of access: World Wide Web.
- text file
- Summary:
- Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found.
- Contents:
- 1. Introduction: Acknowledgments
- 2. Interconnect issues: 2.1. Overview; 2.2. Materials requirements; 2.3. Materials options; 2.4. Multilevel interconnect fabrication
- 3. Copper deposition: 3.1. Overview; 3.2. Chemical deposition methods for copper; 3.3. Physical deposition methods for copper
- 4. Copper patterning: 4.1. Overview; 4.2. Subtractive copper patterning; 4.3. Additive copper patterning by chemical-mechanical polishing (CMP)
- 5. Interlayer dielectrics: 5.1. Silicate-based ILDs; 5.2. Organic polymer-based ILDs; 5.3. Patterning of ILDs
- 6. Cu/ILD barriers: 6.1. Cu/undoped-SiO2 barriers; 6.2. Cu/doped-SiO2 barriers; 6.3. Cu/polymerbarriers
- 7. Current practice: 7.1. Overview; 7.2. Preclean; 7.3. Barrier layers; 7.4. Copper fill methods; 7.5. Future directions
- References
- Index.
- Notes:
- "SPIE Digital Library."--Website.
- Includes bibliographical references (pages 103-117) and index.
- Title from PDF title page (SPIE eBooks Website, viewed 2017-04-03).
- Other Format:
- Print version
- ISBN:
- 9781510608030
- OCLC:
- 985344603
- Access Restriction:
- Restricted for use by site license.
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