Principles of lithography / Harry J. Levinson.

Format:

Book

Author/Creator:

Levinson, Harry J., author.

Contributor:

Society of Photo-Optical Instrumentation Engineers.

Series:

SPIE monograph ; PM146.

SPIE Press monograph ; PM146

Language:

English

Subjects (All):

Microlithography.

Integrated circuits--Design and construction.

Integrated circuits.

Physical Description:

1 online resource (xii, 423 pages) : illustrations, digital file.

Edition:

Second edition.

Place of Publication:

Bellingham, Wash. : SPIE, 2005.

System Details:

Mode of access: World Wide Web.

text file

Summary:

Lithography is a field in which advances proceed at a swift pace. This book was written to address several needs, and the revisions for the second edition were made with those original objectives in mind. Many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail. This book is intended to serve as an introduction to the science of microlithography for people who are unfamiliar with the subject. Topics directly related to the tools used to manufacture integrated circuits are addressed in depth, including such topics as overlay, the stages of exposure, tools, and light sources. This text also contains numerous references for students who want to investigate particular topics in more detail, and they provide the experienced lithographer with lists of references by topic as well. It is expected that the reader of this book will have a foundation in basic physics and chemistry. No topics will require knowledge of mathematics beyond elementary calculus.

Contents:

Preface

1. Overview of lithography

Problems.

2. Optical pattern formation

2.1 The problem of imaging

2.2 Aerial images

2.3 The contribution of physics and chemistry

2.4 Focus

Problems

References.

3. Photoresists

3.1 Positive and negative resists

3.2 Adhesion promotion

3.3 Resist spin coating, softbake, and hardbake

3.4 Photochemistry of novolak: DNQ g- and i-line resists

3.5 Acid-catalyzed DUV resists

3.6 Development and post-exposure bakes

3.7 Operational characterization

3.8 Line edge roughness

3.9 Multilayer resist processes

4. Modeling and thin film effects

4.1 Models of optical imaging

4.2 Aberrations

4.3 Modeling photochemical reactions

4.4 Thin film optical effects

4.5 Post-exposure bakes

4.6 Methods for addressing the problems

of reflective substrates

4.7 Development

5. Wafer steppers

5.1 Overview

5.2 Light sources

5.3 Illumination systems

5.4 Reduction lenses

5.5 Autofocus systems

5.6 The wafer stage

5.7 Scanning

5.8 Dual-stage exposure tools

6. Overlay

6.1 Alignment systems

6.1.1 Classification of alignment systems

6.1.2 Optical methods for alignment and

wafer-to-reticle referencing

6.1.3 Number of alignment marks

6.2 Overlay models

6.3 Matching

6.4 Process-dependent overlay effects

7. Masks and reticles

7.1 Overview

7.2 Mask blanks

7.3 Mechanical optical-pattern generators

7.4 Electron beam lithography and mask writers

7.5 Optical mask writers

7.6 Resists for mask making

7.7 Etching

7.8 Pellicles

8. Confronting the diffraction limit

8.1 Off-axis illumination

8.2 Optical proximity effects

8.3 The mask error factor

8.4 Phase-shifting masks

9. Metrology

9.1 Linewidth measurement

9.1.1 Linewidth measurement using

scanning electron microscope

9.1.2 Scatterometry

9.1.3 Electrical linewidth measurement

9.2 Measurement of overlay

10. The limits of optical lithography

10.1 The diffraction limit

10.2 Improvements in optics

10.3 The shortest wavelength

10.4 Improved photoresists

10.5 Flatter wafers

10.6 How low can k1 go?

10.7 Immersion lithography and maximum numerical aperture

10.8 How far can optical lithography be extended?

10.9 Resist limits

10.10 Interferometric lithography

11. Lithography costs

11.1 Cost of ownership

11.1.1 Capital costs

11.1.2 Consumables

11.1.3 Mask costs

11.1.4 Rework

11.1.5 Metrology

11.1.6 Maintenance costs

11.1.7 Labor costs

11.1.8 Facilities costs

11.2 Mix and match strategies

12. Alternative lithography techniques

12.1 Proximity x-ray lithography

12.2 Extreme ultraviolet lithography - EUV

12.3 Electron-beam direct-write lithography

12.4 Electron-projection lithography - EPL

12.4.1 Small-field EPL systems

12.4.2 Large-field EPL systems

12.5 Ion-projection lithography - IPL

12.6 Imprint lithography

12.7 The ultimate future of lithography

References.

Appendix A. Coherence

References

Index.

Notes:

"SPIE digital library."

Includes bibliographical references (pages 404-412) and index.

ISBN:

9780819478832

OCLC:

435971871

Access Restriction:

Restricted for use by site license.