3D IC devices, technologies, and manufacturing / Hong Xiao.

Format:

Book

Author/Creator:

Xiao, Hong, 1961- author.

Contributor:

Society of Photo-Optical Instrumentation Engineers, publisher.

Series:

SPIE monograph ; PM265.

SPIE digital library

SPIE Press monograph ; PM265

Language:

English

Subjects (All):

Three-dimensional integrated circuits.

Genre:

Electronic books.

Physical Description:

1 online resource (204 pages).

Place of Publication:

Bellingham, Washington : SPIE, 2016.

System Details:

Mode of access: World Wide Web.

text file

Summary:

This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.

Contents:

Preface

1. Manufacturing processes of 3D IC devices: 1.1. Introduction; 1.2. 3D devices in the DRAM and BWL DRAM process; 1.3. Brief summary of DRAM; 1.4. Review questions

2. 3D-NAND flash and its manufacturing process: 2.1. Introduction; 2.2. 3D-NAND flash memory manufacturing processes; 2.3. 3D-NAND summary and discussion; 2.4. Review questions

3. High-k, metal-gate FinFET CMOS manufacturing process: 3.1. Introduction; 3.2. FinFET basics; 3.3. FinFET process; 3.4. Advanced FinFET CMOS process; 3.5. Advanced FinFET SRAM; 3.6. FinFET CMOS scaling; 3.7. Review questions

4. Summary and future trends of the 3D IC process: 4.1. Scaling MOSFET technology after 14 nm; 4.2. Scaling and development of memory devices; 4.3. 3D packaging; 4.4. Other 3D devices and 3D IC processing techniques; 4.5. The end of Moore's Law?

References

Index.

Notes:

"SPIE Digital Library."--Website.

Includes bibliographical references and index.

Title from PDF title page (SPIE eBooks Website, viewed 2016-04-04).

Other Format:

Online version: Xiao, Hong, 1961- author. 3D IC devices, technologies, and manufacturing

Print version

ISBN:

9781510601475

OCLC:

945586106

Access Restriction:

Restricted for use by site license.