Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang [and three others].

Format:

Book

Author/Creator:

Zhang, Hengyun, author.

Series:

Woodhead Publishing series in electronic and optical materials.

Woodhead Publishing Series in Electronic and Optical Materials

Language:

English

Subjects (All):

Electronic apparatus and appliances--Packaging.

Electronic apparatus and appliances.

Physical Description:

1 online resource (436 pages).

Edition:

1st ed.

Place of Publication:

Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]

Summary:

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D.

Contents:

Front Cover

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Series on Advanced Electronic Packaging Technology and Key Materials

Modeling, Analysis, Design,and Tests for Electronics Packaging beyond Moore

Copyright

Contents

About the authors

Preface

Acknowledgments

1 - Introduction

1.1 Evolution of integrated circuit packaging

1.1.1 Evolution of integrated circuit devices and applications

1.1.2 Evolution of integrated circuit packaging

1.1.3 Challenges and solutions

1.2 Performance and design methodology for integrated circuit packaging

1.2.1 Electrical performance and design methodology

1.2.2 Thermal performance and design methodology

1.2.3 Stress and reliability issues

References

Further reading

2 - Electrical modeling and design

2.1 Fundamental theory

2.1.1 Electrical analysis for advanced packaging

2.1.2 Signal distribution

2.1.3 Power allocation

2.1.4 Electromagnetic compatibility and interference

2.2 Modeling, characterization, and design of through-silicon via packages

2.2.1 Through-silicon via modeling

2.2.1.1 Through-silicon via structure

2.2.1.2 Circuit modeling

2.2.1.2.1 Metal-oxide-semiconductor effect

2.2.1.2.2 RLCG parameters

2.2.1.3 Floating substrate Effect

2.2.2 Through-silicon via optimization

2.2.2.1 CNT/Cu-CNT TSVs

2.2.2.2 Coaxial through-silicon vias

2.2.3 Through-silicon via signal/power integrity

2.2.3.1 Crosstalk Effect

2.2.3.2 Differential signaling

2.2.3.3 Power distribution network impedance

2.2.4 TSV/IPD interposer

3 - Thermal modeling, analysis, and design

3.1 Principles of thermal analysis and design

3.1.1 Principles of thermal analysis

3.1.1.1 Heat conduction

3.1.1.2 Micro- and nanoscale effect on heat conduction

3.1.1.3 Heat convection.

3.1.1.4 Thermal radiation

3.1.1.5 Thermal resistance

3.1.1.6 Heat conduction through radial systems

3.1.2 Thermal interfacial resistance

3.1.3 Heat transfer from extended fin surfaces

3.1.4 Heat generation in electronics systems

3.2 Package-level thermal analysis and design

3.2.1 Analytical solutions for analysis of through-silicon vias

3.2.1.1 Porous media model

3.2.1.2 Submodels of through-silicon vias

3.2.2 Submodels for substrate and redistribution layer

3.2.3 Thermal model for 3D integrated circuit package

3.3 Numerical modeling

3.3.1 Governing equations

3.3.2 Numerical modeling of a 2.5D package

3.3.3 Package thermal performance

3.4 Package-level thermal enhancement

3.4.1 Thermal performance under natural convection

3.4.2 Liquid cooling of 3D package

3.4.3 Thermal enhancement with new materials

3.5 Air cooling for electronic devices with vapor chamber configurations

3.6 Liquid cooling for electronic devices

3.6.1 Analytical model for finned heat sink

3.6.2 Analytical results and comparison with experimental measurements

3.6.3 Anatomy of thermal resistance elements

3.7 Thermoelectric cooling

3.7.1 Analytical solution at pellet level

3.7.2 Analytical solution at module level

3.7.3 Results and discussion on the thermoelectric cooler optimization

3.7.3.1 Comparison with previous studies

3.7.3.2 Thermoelectric cooler optimization through Tj minimization

3.7.4 Optimizing thermal resistances

4 - Stress and reliability analysis for interconnects

4.1 Fundamental of mechanical properties

4.1.1 Stress-strain relationship

4.1.2 Viscoplastic and viscoelastic properties

4.1.2.1 Viscoplastic Anand model of solder

4.1.2.2 Viscoelastic properties

4.1.3 Creep-fatigue properties

4.1.3.1 Creep model.

4.1.3.2 Elastic-plastic-creep model

4.1.3.3 Solder fatigue life models

4.1.3.3.1 Stress-based fatigue models

4.1.3.3.2 Strain-based fatigue models

4.1.3.3.2.1 Plastic strain fatigue model

4.1.3.3.2.2 Creep strain fatigue model

4.1.3.3.2.3 Total strain fatigue model

4.1.3.3.3 Energy-based fatigue models

4.1.3.3.4 Fracture mechanics approach

4.2 Reliability test and analysis methods

4.2.1 Thermal cycling test and analysis

4.2.1.1 Thermal cycling test and failure analysis

4.2.1.2 Thermal cycling fatigue life analysis

4.2.1.2.1 Material property model

4.2.1.2.2 Finite element analysis modeling and life prediction

4.2.1.2.2.1 Finite element analysis model

4.2.1.2.2.2 Finite element analysis simulation results and discussion

4.2.1.2.2.3 Parametric study using finite element analysis (FEA) simulation

4.2.1.2.2.4 Effect of IMC layer on life prediction

4.2.1.3 Summary on thermal cycling reliability test and analysis

4.2.2 Mechanical bending test and analysis

4.2.2.1 Isothermal cyclic bend test and analysis

4.2.2.1.1 Test vehicle and experimental procedure

4.2.2.1.2 Correlation between three-point bend and four-point bend test

4.2.2.1.3 Three-point cyclic bend test

4.2.2.1.4 Four-point cyclic bend test for correlation

4.2.2.1.5 Four-point cyclic bend test at 25 and 125°C

4.2.2.2 Finite element analysis for cyclic bend test

4.2.2.2.1 Submodeling method for bend test

4.2.2.2.2 Finite element model modeling for three-point cyclic bend test

4.2.2.2.3 Finite element analysis modeling for four-point cyclic bend test

4.2.2.2.3.1 Correlation between three-point bend and four-point bend test

4.2.2.2.3.2 Finite element analysis modeling and result discussion on bend test at 25°C

4.2.2.2.3.3 Finite element analysis modeling and result discussion on bend test at 125°C.

4.2.2.3 Fatigue model development for cyclic bend test

4.2.2.4 Summary on bend test and analysis

4.2.3 Vibration test and analysis

4.2.3.1 Vibration test approach

4.2.3.1.1 Test vehicle and setup

4.2.3.1.2 Frequency-scanning test

4.2.3.1.3 Sweep vibration reliability test

4.2.3.1.4 Cumulative damage index fatigue analysis

4.2.3.2 Finite element analysis for vibration test

4.2.3.2.1 Modal analysis of flip-chip-on-board assembly

4.2.3.2.2 Quasi-static analysis for vibration fatigue

4.2.3.2.2.1 Determination of quasi-static load

4.2.3.2.2.2 Determination of stress amplitude

4.2.3.2.2.3 Vibration fatigue life prediction

4.2.3.2.3 Harmonic response analysis

4.2.3.3 Summary on vibration test and analysis

4.2.4 Drop impact test and analysis

4.2.4.1 Drop impact test approach

4.2.4.1.1 Test vehicle and set up

4.2.4.1.2 Drop reliability test and analysis

4.2.4.1.3 Charpy impact test and analysis

4.2.4.2 Finite element analysis for drop impact test

4.2.4.2.1 Material property of solder

4.2.4.2.2 Finite element model

4.2.4.2.3 Simulation results and discussion

4.2.4.2.3.1 Results based on elastic model of solder

4.2.4.2.3.2 Results based on plastic model of solder

4.2.4.2.3.3 Life prediction for drop test

4.2.4.3 Design-for-reliability methodology for drop test

4.2.4.4 Summary on drop impact test and analysis

4.3 Case study of design-for-reliability

4.3.1 Design-for-reliability using finite element method

4.3.2 Optimization of package design

4.3.3 Case study

4.3.3.1 Problem statement

4.3.3.2 Die strength characterization

4.3.3.3 Finite element analysis and optimization

4.3.3.3.1 Finite element model

4.3.3.3.2 Analysis for stacking the middle die

4.3.3.3.3 Analysis for stacking the top die

4.3.3.3.4 Optimization of bump layout design.

4.3.3.4 Experimental validation

4.3.3.5 Summary

5 - Reliability and failure analysis of encapsulated packages

5.1 Typical integrated circuit packaging failure modes

5.2 Heat transfer and moisture diffusion in plastics integrated circuit packages

5.2.1 Governing equations for heat and moisture diffusion

5.2.2 Constitutive relations for water vapor

5.2.3 Initial and boundary conditions

5.2.4 Boundary condition during vapor phase reflow

5.2.5 Solution procedure

5.2.6 Finite element analysis

5.2.7 Results and discussion

5.2.7.1 Moisture distributions during preconditioning

5.2.7.2 Temperature and moisture distribution during vapor phase reflow

5.2.7.3 Vapor pressure buildup in the delaminated gap during vapor phase reflow

5.3 Thermal- and moisture-induced stress analysis

5.3.1 Development of thermal stress

5.3.2 Development of hygrostress

5.3.3 Case study for hygrothermal stress analysis

5.3.3.1 Observed failure modes of TQFP package

5.3.3.2 Design and material properties

5.3.3.3 Finite element analysis

5.4 Fracture mechanics analysis in integrated circuits package

5.4.1 Measurement of interfacial fracture toughness

5.4.2 Interfacial fracture analysis

5.4.2.1 Criterion for delamination growth

5.4.2.2 Finite element analysis

5.4.3 Results and discussion

5.4.4 Summary

5.5 Reliability enhancement in PBGA package

5.5.1 Characterization and improvement of moisture sensitivity of performance of PBGA

5.5.1.1 Impact of reflow soldering temperature (260°C) on MSL of nongreen PBGA

5.5.1.2 Enhancing adhesion strength at Cu to solder mask interface

5.5.1.3 Improving the mechanical properties of solder mask materials

5.5.2 Reliability assessment for PBGA packages

5.5.3 Summary

Further reading.

6 - Thermal and mechanical tests for packages and materials.

Notes:

Description based on: online resource; title from pdf title page (Knovel, viewed June 17, 2020)

Description based on publisher supplied metadata and other sources.

ISBN:

9780081025338

0081025335

9780081025321

0081025327

OCLC:

1128445955