Developments in surface contamination and cleaning : methods for surface cleaning / edited by Rajiv Kohli and K. L. Mittal.

Format:

Book

Author/Creator:

Kohli, Rajiv, author.

Contributor:

Kohli, Rajiv, editor.

Mittal, K. L., editor.

Series:

Developments in Surface Contamination and Cleaning Series ; Volume 9

Language:

English

Subjects (All):

Surfaces (Technology)--Inspection.

Surfaces (Technology).

Surface contamination--Prevention.

Surface contamination.

Particles--Measurement.

Particles.

Physical Description:

1 online resource (214 pages) : illustrations (some color), graphs.

Edition:

1st edition

Place of Publication:

Amsterdam, [Netherlands] : William Andrew, 2017.

System Details:

text file

Summary:

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9 , part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. Provides a comprehensive coverage of innovations in surface cleaning Written by established experts in the surface cleaning field, presenting an authoritative resource Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process

Contents:

Front Cover

Developments in Surface Contamination and Cleaning

Copyright Page

Contents

List of Contributors

About the Editors

Preface

1 Nonaqueous Cleaning Challenges for Preventing Damage to Fragile Nanostructures

1 Introduction

2 Water-Caused Problems in Device Fabrication

2.1 High Resistivity of Water

2.2 High Reactivity of Water with Silicon

2.3 High Permittivity of Water

2.4 Dissolution and Corrosion of Metals in Water

2.5 High Surface Tension of Water

3 HF Vapor Processing

4 Cryogenic Aerosol Nitrogen Cleaning

5 Supercritical Fluid Cleaning

5.1 Wafer Drying with SCCO2

5.2 Wafer Cleaning with SCCO2

6 Pinpoint Cleaning

6.1 Laser Cleaning

6.2 Atomic Force Microscopy Nanoprobe Sweeping

6.3 Nanotweezers Pickup

7 Summary

References

2 Gas-Phase Cleaning for Removal of Surface Contaminants

2 Surface Contamination and Cleanliness Levels

3 General Principles of Gas-Phase Cleaning

4 Process Variables in Gas-Phase Cleaning

4.1 Types of Gases

4.2 Cleaning Process Parameters

4.3 Gas Sources and Their Availability

4.4 Types of Contaminants

4.5 Types of Substrates

5 Cleaning Systems

6 Cost Benefits

7 Advantages and Disadvantages of Gas-Phase Cleaning

7.1 Advantages

7.2 Disadvantages

8 Applications

8.1 Precision Cleaning and Etching

8.1.1 Deposition Tool Chamber Cleaning

8.1.2 Dry Etching and Micromachining

8.1.3 Alternative Gas Chemistries

8.2 Sterilization

8.3 Microbial Decontamination

8.3.1 Removal of Biofilms

8.3.2 Decontamination of Biological Safety Cabinets

8.3.3 Alternative Decontamination Agents

8.3.4 Spacecraft Decontamination

8.4 Nuclear Materials Decontamination

8.4.1 Radioactively Contaminated Materials

8.4.2 Gaseous Diffusion Technology Residues.

8.4.3 Alternative Gas Chemistries for Fluorination of Actinide Species

9 Summary

AcknowledgementS

Disclaimer

3 Laser-Induced Spray Jet Cleaning

2 Laser-Induced Spray Jet Cleaning

2.1 Concept of Laser-Induced Spray Jet Cleaning

2.2 Particle Removal Mechanism

3 Nanoscale Particle Removal

3.1 Experimental Setup

3.2 Hydrodynamic Phenomena

3.2.1 Effect of Incident Laser Energy (E)

3.2.2 Effect of Droplet Position (s)

3.2.3 Effect of Droplet Size (D)

3.3 Cleaning Results

3.3.1 Optimization of Microspray Jet

3.3.2 Effect of Process Parameters

3.3.3 Sub-100-nm Particle Cleaning

4 LSJC Using Isopropyl Alcohol

4.1 Hydrodynamic Phenomena

4.2 Nanoscale Particle Cleaning

4.3 Side Effects of LSJC

5 Summary and Conclusions

Acknowledgements

4 Brush Scrubbing for Post-CMP Cleaning

2 Particle Removal Mechanism

3 Process and Tool Kinematics

4 Consumables

4.1 Brush

4.2 Chemical Formulations

5 Related Issues

6 Summary

Appendix: Application of Tribology to Post-CMP Brush Scrubbing

5 Contamination Removal From UV and EUV Photomasks

2 Effect of Photomask Contamination on Lithography Process

2.1 Photomask for Lithography Process

2.2 Photomask Contamination

2.3 Impact of Contamination on Mask Properties and Imprinted Images

3 Haze Effect on Photomask Surface

3.1 Background

3.2 Major Components of Haze

3.3 Haze Control

4 The Particle Removal Process

4.1 Megasonic Cleaning

4.2 Jet Spray Cleaning

4.2.1 Gas Flow Rate

4.2.2 Liquid Flow Rate

4.2.3 Distance Between the Nozzle and the Photomask Surface

4.2.4 Nozzle Design

4.2.5 Other Parameters

4.2.6 Challenges and Future Scope

4.3 Aerosol Cleaning

5 Organics Removal

5.1 SPM Cleaning.

5.2 Ozone Cleaning

5.2.1 Ozone Reactions with Organics

5.2.2 Ozone-Cleaning Process

6 EUVL Mask Cleaning

6.1 Impact of Contamination on EUV Mask

6.2 Cleaning Process to Remove Hydrocarbon Contamination

6.3 Cleaning Process to Remove Particle Contamination

6 Aqueous Displacement of Water-Immiscible Cleaning Solvents: Cleaning Enhancement Using Ultrasonics

1 Background

2 The Aqueous Displacement Solution Process

3 ADS Cleaning Process Requirements and Parameters

4 Drying

4.1 Method 1

4.2 Method 2

4.3 Method 3

4.4 Results

5 Evaluation for Hydrophilicity and Wettability

6 Results of Displacement Tests

7 Cleanliness Evaluation Tests

8 Summary

Index

Back Cover.

Notes:

Includes bibliographical references at the end of each chapters and index.

Description based on online resource; title from PDF title page (ebrary, viewed November 18, 2016).