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Statistical case studies for industrial process improvement / Veronica Czitrom, Patrick D. Spagon.
- Format:
- Book
- Author/Creator:
- Czitrom, Veronica.
- Series:
- ASA-SIAM series on statistics and applied probability.
- ASA-SIAM series on statistics and applied probability
- Language:
- English
- Subjects (All):
- Process control--Statistical methods--Case studies.
- Process control.
- Semiconductor industry--Statistical methods--Case studies.
- Semiconductor industry.
- Physical Description:
- 1 electronic text (xxvii, 514 p.) : ill., digital file.
- Place of Publication:
- Philadelphia, Pa. : Society for Industrial and Applied Mathematics (SIAM, 3600 Market Street, Floor 6, Philadelphia, PA 19104), 1997.
- Language Note:
- English
- System Details:
- Mode of access: World Wide Web.
- System requirements: Adobe Acrobat Reader.
- Summary:
- This book contains a broad selection of case studies written by professionals in the semiconductor industry that illustrate the use of statistical methods to improve manufacturing processes. These case studies offer engineers, scientists, technicians, and managers numerous examples of best-in-class practices by their peers. Because of the universal nature of statistical applications, the methods described here can be applied to a wide range of industries, including the chemical, biotechnology, automotive, steel, plastics, textile, and food industries. Many industries already benefit from the use of statistical methods, although the semiconductor industry is considered both a leader in and a model for the wide application and effective use of statistics.
- Contents:
- Table of contents
- Foreword
- Preface
- Acknowledgments
- Introduction
- Facts about SEMATECH
- SEMATECH qualification plan
- Part One. Gauge studies
- 1. Introduction to gauge studies
- 2. Prometrix RS35e gauge study in five two-level factors and one three-level factor
- 3. Calibration of an FTIR spectrometer for measuring carbon
- 4. Revelation of a microbalance warm-up effect
- 5. GRR methodology for destructive testing and quantitative assessment of gauge capability for one-side specifications
- Part Two. Passive data collection
- 6. Introduction to passive data collection
- 7. Understanding the nature of variability in a dry etch process
- 8. Virgin versus recycled wafers for furnace qualification, is the expense justified?
- 9. Identifying sources of variation in a wafer planarization process
- 10. Factors which affect the number of aerosol particles released by clean room operators
- 11. A skip-lot sampling plan based on variance components for photolithographic registration measurements
- 12. Sampling to meet a variance specification, clean room qualification
- 13. Snapshot, a plot showing progress through a device development laboratory
- Part Three. Design of experiments
- 14. Introduction to design of experiments
- 15. Elimination of TiN peeling during exposure to CVD tungsten deposition process using designed experiments
- 16. Modeling a uniformity bulls-eye inversion
- 17. Using fewer wafers to resolve confounding in screening experiments
- 18. Planarization by chemical mechanical polishing, a rate and uniformity study
- 19. Use of experimental design to optimize a process for etching polycrystalline silicon gates
- 20. Optimization of a wafer stepper alignment system using robust design
- 21. Application of semi-empirical model building to the RTCVD of polysilicon
- Part Four. Statistical process control
- 22. Introduction to statistical process control
- 23. Removing drift effects when calculating control limits
- 24. Implementation of a statistical process control capability strategy in the manufacture of raw printed circuit boards for surface mount technology
- 25. Obtaining and using statistical process control limits in the semiconductor industry
- Part Five. Equipment reliability
- 26. Introduction to equipment reliability
- 27. Marathon report for a photolithography exposure tool
- 28. Experimentation for equipment reliability improvement
- 29. How to determine component-based preventive maintenance plans
- Part Six. Comprehensive case study
- 30. Introduction to comprehensive case study
- 31. Characterization of a vertical furnace chemical vapor deposition (CVD) silicon nitride process
- Appendix. Introduction to integrated circuit manufacturing
- Glossary of selected statistical terms
- Index of selected statistical terms.
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
- Includes bibliographical references and index.
- Title from title screen, viewed 12/30/2010.
- ISBN:
- 0-89871-976-3
- Publisher Number:
- SA01 SIAM
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