Flexible electronics. Volume 1, Mechanical background, materials and manufacturing / Vinod Kumar Khanna.

Format:

Book

Author/Creator:

Khanna, Vinod Kumar, 1952- author.

Contributor:

Institute of Physics (Great Britain), publisher.

Series:

IOP (Series). Release 6.

IOP expanding physics

[IOP release 6]

IOP expanding physics, 2053-2563

Language:

English

Subjects (All):

Flexible electronics.

Physical Description:

1 online resource (various pagings) : illustrations (chiefly color).

Other Title:

Mechanical background, materials and manufacturing.

Place of Publication:

Bristol [England] (Temple Circus, Temple Way, Bristol BS1 6HG, UK) : IOP Publishing, [2019]

System Details:

Mode of access: World Wide Web.

System requirements: Adobe Acrobat Reader, EPUB reader, or Kindle reader.

text file

Biography/History:

Vinod Kumar Khanna is a former Emeritus Scientist at CSIR-Central Electronics Engineering Research Institute, Pilani, India, and Emeritus Professor at the Academy of Scientific & Innovative Research, India. He is a retired Chief Scientist and Head of the MEMS & Microsensors Group, CSIR-CEERI, Pilani.

Summary:

Flexible electronics is a fast-emerging field with the potential for huge industrial importance. Comprising three volumes, this work offers a cohesive, coherent and comprehensive overview of the field. Themes covered include mechanical theory, materials science aspects, fabrication technologies, devices, and applications.

Contents:

1. The flexible electronics paradigm

1.1. Introduction

1.2. Traditional versus flexible electronics

1.3. Three-pronged approach to flexible electronics

1.4. Defining flexible electronics

1.5. Broad scope of flexible electronics

1.6. Organization of the book

1.7. Discussion and conclusions

part I. Mechanical background. 2. Mechanical bending of a circuit

2.1. Introduction

2.2. Bending-mode deformation

2.3. Curvature and radius of curvature

2.4. Neutral axis

2.5. Critical strain and critical radius of curvature

2.6. [epsilon]Critical and [rho]Critical as characteristic parameters defining flexible, compliant and stretchable electronics

2.7. Discussion and conclusions

3. Stresses and strains in the hard-film-soft-substrate structure

3.1. Introduction

3.2. Stresses in thin films

3.3. Built-in residual stress

3.4. Tensile versus compressive built-in stress in a film-on-foil structure in flexible electronics

3.5. Thermal coefficient mismatch stress

3.6. Mechanical stress and strain at different stages in a film-on-foil structure

3.7. Modeling the film-on-foil structure

3.8. Applications of the model

3.9. Discussion and conclusions

4. Curvature and overlay alignment of the hard-film-soft-substrate structure

4.1. Introduction

4.2. Classical theory of curvature produced by thin film deposition

4.3. Evolution of spherical shape from the dominance of the substrate effect

4.4. Radius of curvature of cylindrical roll contour for a compliant substrate

4.5. Discussion and conclusions

5. Providing stretchability by controlled buckling of films

5.1. Introduction

5.2. Spontaneously produced ordered structures

5.3. Using ordered structures in stretchable electronics

5.4. Process of formation of activated/inactivated sites

5.5. The buckling profile

5.6. Approach and assumptions in the formulation of buckling geometry model

5.7. Bending energy Ub in thin film

5.8. Membrane strain ([epsilon]11)

5.9. In-plane displacement u1

5.10. Modifying the strain equation

5.11. Membrane energy in the thin film (Um)

5.12. Substrate energy (Us)

5.13. Total energy (U)

5.14. Amplitude and critical strain

5.15. Independence of amplitude from thin film properties

5.16. Maximum strain

5.17. Environmental protection of buckled thin film in a practical application

5.18. Substrate effects

5.19. Discussion and conclusions

6. Bending brittle films

6.1. Introduction

6.2. Failure by cracking, slipping and delamination

6.3. Surface strain, interfacial shear stress and interfacial normal (or peeling) stress

6.4. Applying self-equilibrium beam theory for trilayer electronic assemblies

6.5. Analyzing a structure with a slipping crack on the interface between Si thin film and PET substrate

6.6. Fracture toughness and delamination toughness of brittle thin films on compliant substrates by controlled buckling experiments

6.7. Building self-healing capabilities in circuits

6.8. Discussion and conclusions

7. Deformation and cycling of ductile films

7.1. Introduction

7.2. In situ fragmentation testing of copper films

7.3. Cyclic bending of copper films

7.4. Discussion and conclusions

8. Straining permeation barriers

8.1. Introduction

8.2. The electromechanical two-point bending equipment

8.3. The [delta]R/R0 ratio-strain curve for the film

8.4. Internal compressive strain in the film

8.5. Controlling internal compressive strain in a film

8.6. Inorganic-organic multilayer permeation barrier

8.7. Failure mechanisms of inorganic/organic coatings

8.8. Discussion and conclusions

part II. Materials. 9. Inorganic materials

9.1. What are inorganic materials?

9.2. Amorphous silicon films

9.3. Hydrogen-terminated amorphous silicon (a-Si:H) films

9.4. Nanocrystalline (nc), microcrystalline ([mu]c) and polycrystalline (pc) silicon films

9.5. Solution-processed a-Si and pc-Si films

9.6. Transparent oxides

9.7. Zinc oxide-based binary and ternary oxides

9.8. High dielectric constant materials

9.9. Discussion and conclusions

10. Organic materials

10.1. What are organic materials?

10.2. Mechanisms of electrical behavior of organic compounds

10.3. Dielectric materials

10.4. Semiconducting materials

10.5. Organic conductors

10.6. Discussion and conclusions

11. Nanomaterials : CNTs, nanowires, graphene and 2D materials

11.1. What is a nanomaterial?

11.2. Two approaches to nanomaterial film growth/deposition on flexible substrates

11.3. Direct CNT growth on PI

11.4. Direct Si NW growth on PI

11.5. Direct graphene pattern growth on flexible glass substrate

11.6. Direct low-temperature synthesis of MoS2 on PI substrate

11.7. CNT film transfer to any substrate

11.8. Microwave-assisted V-CNT array patterning on PC substrate

11.9. Transfer printing of silicon NWs to PDMS

11.10. PMMA-mediated graphene transfer to non-specific substrates

11.11. Graphene transfer to PET substrate via hot-press lamination (HPL) and ultraviolet adhesive (UVA)

11.12. Transfer of MoS2 devices to PI foil

11.13. Discussion and conclusions

part III. Manufacturing equipment and machines. 12. Printing techniques

12.1. What is printing?

12.2. Classification of printing technologies (I) : subtractive versus additive

12.3. Classification of printing technologies (II) : contact versus non-contact

12.4. Gravure printing

12.5. Gravure offset printing

12.6. Flexographic printing

12.7. Lithographic printing

12.8. Offset lithographic printing

12.9. Screen printing

12.10. Inkjet printing

12.11. Electrohydrodynamic printing

12.12. Pyroelectrodynamic printing

12.13. Dielectrophoretic printing

12.14. Surface acoustic wave (SAW) printing

12.15. Discussion and conclusions

13. Vacuum deposition

13.1. What is vacuum deposition?

13.2. Vacuum evaporation

13.3. Sputtering

13.4. Molecular beam epitaxy (MBE)

13.5. Organic molecular beam deposition (OMBD)

13.6. Organic vapor phase deposition (OVPD)

13.7. Chemical vapor deposition (CVD)

13.8. Discussion and conclusions

14. Silicon microelectronics/MEMS processes

14.1. Introduction

14.2. Thermal oxidation of silicon

14.3. Thermal diffusion of impurities into silicon

14.4. Ion implantation

14.5. Photolithography (deep UV or optical lithography) and etching

14.6. Electron-beam (e-beam) lithography

14.7. Discussion and conclusions

15. Packaging

15.1. Electronic packaging or encapsulation

15.2. Ultra-thin chip-in flex technology

15.3. Flip-chip assembly of ultra-thin silicon chips on flexible substrates

15.4. High-yield manufacturing process for flip-chip assembly of 25 [mu]m thick silicon dies on polyimide substrates

15.5. Laser-enabled advanced packaging (LEAP)

15.6. Thermo-mechanical selective laser-assisted die transfer (tmSLADT) method

15.7. Discussion and conclusions.

Notes:

"Version: 20190701"--Title page verso.

Includes bibliographical references.

Title from PDF title page (viewed on August 15, 2019).

Other Format:

Print version:

ISBN:

9780750314626

9780750314633

OCLC:

1112388776

Access Restriction:

Restricted for use by site license.