Handbook of materials failure analysis : with case studies from the electronic and textile industries / edited by Abdel Salam Hamdy Makhlouf, Mahmood Aliofkhazraei.

Format:

Book

Author/Creator:

Makhlouf, Abdel Salam Hamdy.

Contributor:

Makhlouf, Abdel Salam Hamdy, editor.

Aliofkhazraei, Mahmood, editor.

Language:

English

Subjects (All):

Fracture mechanics--Handbooks, manuals, etc.

Fracture mechanics.

Physical Description:

1 online resource (388 pages)

Edition:

1st ed.

Place of Publication:

Oxford, England ; Cambridge, Massachusetts : Butterworth-Heinemann, [2020]

Summary:

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes.The book begins with a general overview of materials failure analysis and its importance.

Contents:

Front Cover

Handbook of Materials Failure Analysis

Copyright Page

Contents

List of contributors

About the editors

Preface

1 Electronics industries

1 Failures of electronic devices: solder joints failure modes, causes and detection methods

1.1 Introduction

1.2 Thermal cycling

1.3 Shock and vibration

1.4 Failure detection methods in electronics industry

1.5 Conclusion

1.6 Recommendations

References

2 Electron beam radiation and its impacts to failure analysis in semiconductor industry

2.1 Introduction

2.2 Impact of electron beam radiation damage during SEM failure analysis

2.2.1 SEM physical FA and low-k/ultralow-k dielectrics

2.2.2 Electron beam radiation damage to low-k and ultralow-k dielectric materials

2.2.2.1 Electron beam-induced knock-on damage

2.2.2.2 Electron beam-induced thermal damage

2.2.2.3 Electron beam-induced radiolysis damage

2.2.3 Control of electron beam radiation damage to low-k and ultralow-k dielectric materials

2.2.3.1 The effects of acceleration voltage

2.2.3.2 The effects of probe current

2.2.3.3 The effects of Pt anticharging coat layer

2.3 Impact of electron beam radiation during FIB and TEM failure analysis: radiation damage to LK and ULK dielectrics

2.3.1 Electron beam radiation damage during electron beam survey before focus ion beam milling

2.3.2 Electron beam radiation damage during electron beam coating before focus ion beam milling

2.3.3 Electron beam radiation damage during focus ion beam milling for transmission electron microscopy sample preparation

2.3.4 Electron beam radiation damage during transmission electron microscope analysis

2.4 Impact of electron beam radiation damage during TEM failure analysis: radiation damage to silicon nitride.

2.5 Impact of electron beam radiation damage during TEM FA: boron diffusion and segregation induced phase and microstructur...

2.5.1 Stage-I: The electron radiation-induced unilateral amorphization of Co3Fe thin film

2.5.2 Stage-II: The electron radiation-induced recrystallization in the amorphized Co3Fe thin film

2.6 Conclusion

3 Failure of intermetallic solder ball due to stress shielding and amplification effects

3.1 Introduction

3.2 Methodology

3.2.1 Finite element modeling

3.2.1.1 Finite element modeling based on Brown &amp

Srawley analytical model

3.2.1.2 Finite element solder joint modeling

3.2.1.3 Multiple cracks analysis on solder joint behavior-parallel edge cracks

3.2.1.4 Multiple cracks analysis on solder joint behavior-coplanar cracks

3.3 Results and discussion

3.3.1 The effect of distance (B) between two parallel edge cracks

3.3.2 Multiple crack analysis-coplanar cracks

3.3.2.1 The effect of horizontal (x) distance between the coplanar crack tips

3.3.2.2 The effect of horizontal (y) distance between the coplanar crack tips

3.4 Conclusion

Acknowledgment

Further reading

4 Assessment of failure of consumer electronics due to indoor corrosion in subtropical climates

4.1 Introduction

4.2 Methods

4.3 Damage analysis

4.4 Discussion

4.5 Conclusion

Acknowledgments

5 Pb-free solder-microstructural, material reliability, and failure relationships

5.1 Introduction

5.1.1 Development of Pb-free solder alloys

5.1.2 Failure and microstructure

5.1.3 An overview of the chapter

5.2 Case study I-Pb-doped solder alloys

5.2.1 Forward compatible mixing

5.2.2 Backward compatible mixing

5.2.2.1 Full mix and partial mix

5.2.2.2 Effect of accelerated temperature cycling profile

5.2.2.3 Effect of Ag content.

5.2.3 Lessons learnt from case study I

5.3 Case study II-First- and second-generation Sn-Ag-Cu solder alloys

5.3.1 Effect of ball grid array component

5.3.2 Effect of Ag content

5.3.3 Effect of dwell time

5.3.4 Effect of accelerated temperature cycling profile

5.3.5 Microstructural evolution and failure mechanisms

5.3.6 Lessons learnt from case study II

5.4 Case study III-High-performance solders (third generation)

5.4.1 Effect of micro-alloying on Sn-Ag-Cu

5.4.2 Two commercialized alloys

5.4.3 Lessons learnt from case study III

5.5 Case study IV-Low-temperature solders

5.5.1 Effect of substrate

5.5.2 Effect of micro-alloying

5.5.3 Lessons learnt from case study IV

5.6 Conclusion

6 The role of contamination in the failure of electronics-case studies

6.1 Introduction

6.2 Case studies

6.2.1 Example 1-Contamination as a primary cause of motor failures

6.2.1.1 Introduction

6.2.1.2 Motor operation investigation

6.2.1.3 Electrical characterization

6.2.1.4 Control stock motor

6.2.1.5 Failed motor

6.2.1.6 Chemical characterizations

6.2.2 Example 2-Electrolyte contamination

6.2.2.1 A leaking capacitor

6.2.2.2 Other types of electrolyte contamination damage

6.3 Discussion

7 Analytical solutions for electronic assemblies subjected to shock and vibration loadings

7.1 Introduction

7.2 Test assembly details

7.3 Experimental modal analysis

7.4 Finite element modeling

7.5 Analytical solution details

7.5.1 Free vibration

7.5.2 Forced vibration: harmonic loading

7.5.3 Forced vibration: shock loading

7.6 Results and discussions

7.6.1 Free vibration: natural frequencies and mode shapes

7.6.2 Forced vibration: harmonic loading

7.6.2.1 Corner solder joint deflection validation.

7.6.2.2 Critical solder joint stress analysis

7.6.2.2.1 Printed circuit board stiffness: thickness and modulus of elasticity

7.6.2.2.2 Solder joint geometry: standoff height and diameter

7.6.3 Forced vibration: impact loading

7.6.3.1 Corner solder joint deflection

7.6.3.2 Critical solder joint stress analysis

7.6.3.2.1 Printed circuit board stiffness: thickness and modulus of elasticity

7.6.3.2.2 Solder joint geometry: standoff height and diameter

7.6.3.3 Solder stress response spectrum

7.7 Conclusion

Nomenclature

8 Stress analysis of stretchable conductive polymer for electronics circuit application

8.1 Introduction

8.2 Experimental procedure

8.2.1 Sample preparation

8.2.2 Printing process of circuits

8.2.3 Universal tensile testing

8.3 Stress-strain analysis of substrate and conductive ink

8.3.1 Neo-Hookean model

8.3.2 Multilinear plastic model

8.4 Finite element analysis

8.4.1 Modeling and meshing of different printing shapes models

8.4.2 Boundary conditions

8.4.2.1 Printing circuits

8.4.2.2 Thermal sensor circuit

8.4.3 Analysis using the simulation process

8.5 Results and discussion

8.5.1 Material properties of stretchable electronic circuit material

8.5.2 Deformation behavior of stretchable electronics circuit

8.5.3 Equivalent stress analysis of a thermal sensor circuit design up to 10% strain

8.5.4 Effect of width in reducing the equivalent stress in a thermal sensor circuit

8.5.5 Equivalent stress limitation when the load is applied up to 10% strain

8.6 Future recommendations

8.7 Conclusion

9 New methodology for qualification, prediction, and lifetime assessment of electronic systems

9.1 Introduction

9.2 Improved reliability assessment method

9.2.1 Prediction handbooks.

9.2.2 Life data analysis

9.2.3 Accelerated life testing

9.2.4 Improved reliability estimation methods

9.2.5 Prediction handbooks: FIDES rather than MIL-217F

9.2.6 Intelligent life data analysis rather than real life data averaging

9.2.7 [HALT+ALT] rather than ALT

9.2.8 Reliability block diagram tools and fault tree analysis for complex systems

9.3 Application examples

9.3.1 Electrolytic capacitors reliability analysis

9.3.2 Demonstration of the combined methodology on front light module

9.3.3 Supercapacitors reliability analysis

9.3.3.1 Supercapacitors failure modes

9.3.3.2 Design of an accelerated life test for supercapacitors

9.3.3.2.1 Design of experiments

9.3.3.2.2 Test setup

9.3.3.3 Supercapacitors performance parameters and failure criteria

9.3.3.4 Physics of failure models

9.3.3.4.1 Degradation analysis based on data collected from research (expensive) setup

9.3.3.4.2 Degradation analysis based on data collected from economical (cost-effective) setup

9.3.3.4.3 Physics of failure modeling

9.4 New trends to improve reliability analysis

9.4.1 Mission profile

9.4.2 Online condition monitoring-case study

9.4.2.1 Concepts for connection defects detection, prognostics, and localization

9.4.2.1.1 Method for connection defects detection and localization-based on online impedance measurements

9.4.2.1.2 Method for connection defects detection-based on band-frequency filtering

9.5 Summary

9.6 General observations and conclusion

2 Textiles industries

10 Failure of yarns in different textile applications

10.1 Introduction

10.2 Staple yarn failure depending on the spinning method

10.3 Yarn failure depending on the gauge length

10.4 Yarn failure depending on the strain rate

10.5 Modeling of the yarn failure.

10.6 Yarn failure in fabrics and composite structures.

Notes:

Description based on print version record.

Description based on publisher supplied metadata and other sources.

ISBN:

9780128113967

0128113960

OCLC:

1125113536