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2019 IEEE/ACM International Conference on Technical Debt (TechDebt) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Software engineering--Congresses.
- Software engineering.
- Physical Description:
- 1 online resource (32 pages) : illustrations
- Other Title:
- 2019 IEEE/ACM International Conference on Technical Debt
- Place of Publication:
- IEEE
- Piscataway, NJ : IEEE, 2019.
- Notes:
- Description based on publisher supplied metadata and other sources.
- Includes bibliographical references and index.
- ISBN:
- 9781728133713
- 1728133718
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