Smart sensors and MEMS : intelligent devices and microsystems for industrial applications / edited by Stoyan Nihtianov, Antonio Luque.

Format:

Book

Author/Creator:

Nihtianov, S, author.

Contributor:

Nihtianov, Stoyan, editor.

Luque, Antonio, editor.

Series:

Woodhead Publishing series in electronic and optical materials.

Woodhead Publishing Series in Electronic and Optical Materials

Language:

English

Subjects (All):

Detectors--Industrial applications.

Detectors.

Microelectromechanical systems--Industrial applications.

Microelectromechanical systems.

Physical Description:

1 online resource (593 pages) : illustrations, tables.

Edition:

Second edition.

Other Title:

Smart sensors and micro-electro-mechanical systems

Place of Publication:

Duxford, England : Woodhead Publishing, 2018.

System Details:

text file

Summary:

Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important developments in the field, including the latest on magnetic sensors, temperature sensors and microreaction chambers. The book outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, among other topics. New sections include discussions on magnetic and temperature sensors and the industrial applications of smart micro-electro-mechanical systems (MEMS). The book is an invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry. In addition, engineers looking for industrial sensing, monitoring and automation solutions will find this a comprehensive source of information. Contains new chapters that address key applications, such as magnetic sensors, microreaction chambers and temperature sensors Provides an in-depth information on a wide array of industrial applications for smart sensors and smart MEMS Presents the only book to discuss both smart sensors and MEMS for industrial applications

Contents:

Front Cover

Smart Sensors and MEMS

Related titles

Copyright

Contents

List of Contributors

1 - What makes sensor devices and microsystems "intelligent" or "smart"?

1.1 Introduction

1.2 Interpretation of terms related to sensors

1.2.1 About the term "sensor"

1.2.2 Definitions of key terms related to devices with elements of artificial intelligence

1.3 Key trends in the development of sensors (sensor devices) and microelectromechanical systems

1.3.1 The method of analogy

1.3.2 Complication of organisms and sensors as a tendency of evolution

1.3.3 Features and forms of intelligence

1.4 Suggestions for improving terminology in the field of sensors and microelectromechanical systems

1.5 Conclusion

Acknowledgment

References

2 - Interfacing sensors to microcontrollers: a direct approach

2.1 Introduction

2.2 Sensors

2.2.1 Resistive sensors

2.2.1.1 Single resistive sensor

2.2.1.2 Differential resistive sensor

2.2.1.3 Bridge-type resistive sensor

2.2.2 Capacitive sensors

2.2.2.1 Single capacitive sensor

2.2.2.2 Lossy capacitive sensor

2.2.2.3 Differential capacitive sensor

2.2.2.4 Bridge-type capacitive sensor

2.3 Microcontrollers

2.3.1 General description

2.3.2 Time-interval measurement

2.4 Interface circuits

2.4.1 Operating principle

2.4.2 Circuits for resistive sensors

2.4.2.1 Single resistive sensor

2.4.2.2 Differential resistive sensor

2.4.2.3 Bridge-type resistive sensor

2.4.3 Circuits for capacitive sensors

2.4.3.1 Single capacitive sensor

2.4.3.2 Lossy capacitive sensor

2.4.3.3 Differential capacitive sensor

2.4.3.4 Bridge-type capacitive sensor

2.5 Applications

2.5.1 Temperature measurement

2.5.2 Position measurement

2.5.3 Magnetic field measurement.

2.5.4 Relative humidity measurement

2.5.5 Tilt measurement

2.5.6 Other applications

2.6 Future trends

Sources of further information and advice

3 - Smart temperature sensors and temperature sensor systems

3.1 Introduction

3.2 Measuring temperature, temperature differences, and temperature changes in industrial applications

3.3 Temperature-sensing elements

3.3.1 Introduction

3.3.2 Temperature sensor characteristics of bipolar junction transistors

3.3.3 ΔVBE temperature sensors

3.3.4 Bipolar junction transistors in complementary metal-oxide semiconductor (CMOS) technology

3.4 Basic concepts of smart temperature sensors

3.4.1 Architectures of smart temperature sensor systems

3.4.2 Temperature sensors with a duty-cycle-modulated (DEM) output

3.5 Methods to improve the accuracy of CMOS smart temperature-sensor systems

3.5.1 Dynamic element matching

3.5.2 Chopping

3.6 Principles of BJT-based smart temperature sensors with DCM

3.7 Signal processing of duty cycle modulated signals

3.7.1 Three methods of averaging

3.7.1.1 First type of averaging: best accuracy at any speed

3.7.1.2 Second type of averaging: simplest method

3.7.1.3 Third method of averaging: best accuracy at intermediate and low speeds

3.8 Fabrication and test results

3.8.1 Fabrication

3.8.2 Accuracy over temperature range and supply voltage range

3.8.3 Noise

3.8.4 Packaging shift and long-term stability

3.8.5 Performance summary

3.8.6 Simple systems with digital and analog signal processing

3.9 Summary

4 - Capacitive sensors for displacement measurement in the subnanometer range

4.1 Introduction

4.2 Challenges for subnanometer displacement measurement with capacitive sensors

4.3 Offset capacitance cancellation technique.

4.4 Capacitance-to-digital converter with offset capacitance cancellation and calibration functions

4.5 Conclusion

5 - Integrated inductive displacement sensors for harsh industrial environments

5.1 Why inductive displacement sensors?

5.2 Principle of operation and practical limitations for eddy-current sensors

5.2.1 Sensor operation principle

5.2.2 Limitations of eddy-current sensors

5.2.2.1 Skin effect

5.2.2.2 Parasitic effects

5.2.2.3 Limited sensing coil quality factor

5.2.2.4 Frequency dependence

5.3 Design requirements in precision industrial applications

5.4 State-of-the-art eddy-current sensor interfaces

5.4.1 Utilizing external switched-capacitor oscillator and LC resonator

5.4.2 Relaxation oscillator-based interface

5.5 Eddy-current sensor interfaces with LC oscillator and ratiometric measurement

5.5.1 Precision peak detection-based eddy-current sensor interface

5.5.2 Trade-offs in mixer-based interfaces

5.5.3 Synchronous detection-based eddy-current sensor interface

5.5.3.1 Sensor interface for mm-range displacement measurement

5.5.3.2 Sensor interface for μm-range displacement measurement

5.6 Summary and design perspectives

Appendix

5.A Sensing coil design aspects

5.A.1 Inductance

5.A.2 Quality factor

5.A.3 Self-resonance frequency

6 - Magnetic sensors and industrial sensing applications

6.1 Introduction

6.1.1 Hall effect

6.1.2 Magnetoresistance effect

6.1.2.1 Electron spin

6.1.3 Giant magnetoresistance

6.1.4 Tunneling magnetoresistance

6.1.5 MR/Hall effect-based angle sensors

6.1.6 Through-shaft magnetic angle sensor

6.1.6.1 Variable reluctance-Hall effect-based angle sensor

6.1.6.2 Signal conditioning circuit and sensor calibration

6.2 Conclusions

References.

7 - Advanced silicon radiation detectors in the vacuum ultraviolet and the extreme ultraviolet spectral range

7.1 Introductory overview

7.2 Challenges for radiation detection in the VUV and EUV spectral ranges

7.3 Device solutions for radiation detection in the VUV and EUV spectral ranges

7.4 Methods of radiometric investigation and characterization

7.5 Spectral responsivity and radiation hardness of VUV and EUV radiation detectors

7.6 Future trends

8 - Advanced interfaces for resistive sensors

8.1 Introduction

8.2 Resistive sensors

8.2.1 Examples of resistive sensors

8.2.1.1 Resistive temperature detectors

8.2.1.2 Light-dependent resistors

8.2.1.3 Resistive gas sensors

8.2.1.4 Strain gauges

8.2.1.5 Potentiometers

8.2.2 Parasitic capacitance

8.3 Voltamperometric resistance estimation

8.3.1 Implementation in smart sensors

8.3.2 Parasitic capacitance issues

8.3.3 Calibration procedures

8.4 Resistance-to-time conversion methods

8.4.1 Oscillator-based systems

8.4.1.1 Parasitic capacitance issues

8.4.1.2 The problem of long measuring times

8.4.2 Systems with constant sensor excitation voltage

8.4.2.1 Long measuring time problem

8.4.2.2 Direct ramp slope estimation

8.4.2.3 Parasitic capacitance estimation

8.5 Industrial-related aspects

8.6 Conclusion and future trends

9 - Reconfigurable ultrasonic smart sensor platform for nondestructive evaluation and imaging applications

9.1 Introduction

9.2 Fundamentals of ultrasonic sensing and pulse-echo measurements

9.3 Reconfigurable ultrasonic smart sensor platform design

9.3.1 System features and user interface

9.3.2 System response and real-time operational requirements

9.3.3 Reconfigurable ultrasonic smart sensor platform architecture.

9.3.4 Analog-to-digital converter to field-programmable gate array interface

9.4 Algorithms used in evaluation of reconfigurable ultrasonic smart sensor platform

9.4.1 Coherent averaging

9.4.2 Split-spectrum processing

9.4.3 Chirplet signal decomposition

9.5 Hardware realization of ultrasonic imaging algorithms using reconfigurable ultrasonic smart sensor platform

9.5.1 Averaging implementation

9.5.2 Split-spectrum processing implementation

9.5.3 Chirplet signal decomposition implementation

9.5.4 Resource usage and timing constraints

9.6 Future trends

9.7 Conclusion

9.8 Sources of further information and advice

10 - Advanced optical incremental sensors: encoders and interferometers

10.1 Introduction

10.2 Displacement interferometers

10.2.1 Basics of displacement interferometry

10.2.1.1 Homodyne interferometers (detection)

10.2.1.2 Heterodyne interferometers (detection)

10.2.1.3 Signals

10.2.2 Interferometer concepts

10.2.2.1 Linear interferometer

10.2.2.2 Plane mirror interferometer

10.2.3 Phase detection and interpolation

10.3 Sources of error and compensation methods

10.3.1 Setup dependent error sources

10.3.1.1 Cosine error

10.3.1.2 Abbe error

10.3.1.3 Dead path error

10.3.1.4 Target uniformity

10.3.1.5 Mechanical stability

10.3.2 Instrument dependent error sources

10.3.2.1 (Split) frequency

10.3.2.2 Beam walk-off

10.3.2.3 Electronics and data age

10.3.2.4 Periodic deviation

10.3.3 Environment dependent error sources

10.3.3.1 Thermal effects on the interferometer

10.3.3.2 Refractive index of air

10.4 Optical encoders

10.4.1 Imaging incremental encoder

10.4.2 Interferential encoders

10.4.2.1 Diffraction physics

10.4.2.2 Sensitivities

10.4.2.3 Schematic setups

10.4.2.4 Phase detection.

10.4.2.5 Tilt sensitivity.

Notes:

Includes bibliographical references at the end of each chapters and index.

Description based on online resource; title from PDF title page (EBC, viewed March 15, 2018).

ISBN:

9780081020555

0081020554

OCLC:

1082522701