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EMPC 2017 : proceedings of the 21st European Microelectronics Packaging Conference :10-13 September 2017, Warsaw, Poland / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Conference Name:
- European Microelectronics and Packaging Conference (21st : 2017 : Warsaw, Poland)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronics--Congresses.
- Microelectronics.
- Physical Description:
- 1 online resource (828 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed March 19, 2020).
- ISBN:
- 0-9568086-4-6
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