2017 6th International Conference on Software Process Improvement (CIMPS) / Institute of Electrical and Electronics Engineers.

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Language:

English

Subjects (All):

Software engineering--Congresses.

Software engineering.

Physical Description:

1 online resource (23 pages)

Other Title:

2017 6th International Conference on Software Process Improvement

Place of Publication:

Piscataway, NJ : IEEE, 2017.

Summary:

The CIMPS 17 is a global conference for researchers and practitioners that present and discuss the most recent innovations, trends, results, experiences and concerns in the several perspectives of Software Engineering with clear relationship but not limited to software processes, Security in Information and Communication Technology and big data Field CIMPS 2016 allows to 1. Promote the collaboration among academic, government and business community 2. Inspire students and researchers interested in Software Process Improvement and Security in Information and Communication Technology with important and high quality speakers 3. Contribute with the development of IT in Mexico.

Notes:

Description based on: online resource; title from PDF information screen (IEEE Xplore Digital Library, viewed April 17, 2023).

Includes bibliographical references and index.

ISBN:

1-5386-3230-6