2017 7th International Conference on Integrated Circuits, Design, and Verification (ICDV) / Institute of Electrical and Electronics Engineers.

Format:

Book

Author/Creator:

Institute of Electrical and Electronics Engineers, author, issuing body.

Language:

English

Subjects (All):

Integrated circuits--Testing--Congresses.

Integrated circuits.

Physical Description:

1 online resource (37 pages)

Other Title:

2017 7th International Conference on Integrated Circuits, Design, and Verification

Place of Publication:

Piscataway, NJ : IEEE, 2017.

Summary:

he International Conference on Integrated Circuits, Design, and Verification (ICDV) provides an annual forum for exchanging ideas, discussing research results, and presenting chips, circuit designs and applications in solid state and semiconductor fields Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain This would certainly provide us a great opportunity for new applications and information processing On the other hands, the small feature size causes new problems such as leakage current and process variation To discuss utilizing the scaling advantages and coping with the new problems, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuits and devices field.

Notes:

Description based on: online resource; title from PDF information screen (IEEE Xplore Digital Library, viewed April 17, 2023).

Includes bibliographical references and index.

ISBN:

1-5386-3377-9