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SIITME : 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging : 26-29 October 2017.
- Format:
- Book
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (458 pages)
- Place of Publication:
- New York : IEEE, 2018.
- Notes:
- Description based on: online resource; title from title screen (IEEE Xplore Digital Library, viewed March 17, 2018).
- ISBN:
- 1-5386-1626-2
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