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SPLC 2016 : 20th International Systems and Software Product Line Conference : proceedings : September 16-23, 2016, Beijing, China / edited by Hong Mei [seventeen others] ; sponsors, Huawei.

ACM Digital Library Available online

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Format:
Book
Conference/Event
Contributor:
Mei, Hong, editor.
Hua wei ji shu you xian gong si, sponsoring body.
Conference Name:
International Software Product Line Conference (20th : 2016 : Beijing, China)
Series:
ACM Other conferences
Language:
English
Subjects (All):
Computer software--Development--Congresses.
Computer software.
Software engineering--Congresses.
Software engineering.
Systems engineering--Congresses.
Systems engineering.
Physical Description:
1 online resource (367 pages)
Other Title:
Software Product Line Conference 2016
Proceedings of the 20th International Systems and Software Product Line Conference
Place of Publication:
New York : ACM, 2016.
Notes:
Description based on: online resource; title from pdf title page (ACM Digital Library, viewed August 21, 2018).
ISBN:
1-4503-4050-4

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