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TEI '08 : second International Conference on Tangible and Embedded Interaction : February 18-20 2008, Bonn, Germany : conference proceedings
- Format:
- Book
- Conference/Event
- Author/Creator:
- International Conference on Tangible and Embedded Interaction, Corporate Author.
- Conference Name:
- Conference on Tangible and Embedded Interaction 2008
- Series:
- ACM Other conferences
- Language:
- English
- Physical Description:
- 1 online resource (267 pages)
- Other Title:
- Proceedings of the 2nd International Conference on Tangible and Embedded Interaction
- TEI '08
- Conference on Tangible and Embedded Interaction 2008 Bonn, Germany - February 18 - 21, 2008
- Place of Publication:
- [Place of publication not identified] ACM 2008
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
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