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2013 1st International Workshop on Release Engineering (RELENG) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Computer software--Congresses.
- Computer software.
- Physical Description:
- 1 online resource (36 pages)
- Other Title:
- 2013 1st International Workshop on Release Engineering
- Release Engineering
- Place of Publication:
- Piscataway, New Jersey : IEEE, 2013.
- Contents:
- Foreword iii
- Adding Automatic Dependency Processing to Makefile-Based Build Systems with Amake
- Jim Buffenbarger - Boise State University, USA 1
- Eliciting Operations Requirements for Applications
- Len Bass, Ross Jeffery, Hiroshi Wada, Ingo Weber, and Liming Zhu - NICTA, Australia; UNSW, Australia 5
- Kanbanize the Release Engineering Process
- Noureddine Kerzazi and Pierre N. Robillard - Payza, Canada; Polytechnique Montréal, Canada . 9
- Ant Build Maintenance with Formiga
- Ryan Hardt and Ethan V. Munson - University of Wisconsin-Milwaukee, USA 13
- Charon: Declarative Provisioning and Deployment
- Eelco Dolstra, Rob Vermaas, and Shea Levy - LogicBlox, USA 17
- Releasing Sooner or Later: An Optimization Approach and Its Case Study Evaluation
- Jason Ho and Guenther Ruhe - University of Calgary, Canada; Expert Decisions, Canada 21
- Branching Strategies Based on Social Networks
- Noureddine Kerzazi - Payza, Canada . 25
- What Effect does Distributed Version Control have on OSS Project Organization?
- Peter C. Rigby, Earl T. Barr, Christian Bird, Premkumar Devanbu, and Daniel M. German - Concordia University, Canada;
- University College London, UK; Microsoft Research, USA; UC Davis, USA; University of Victoria, Canada 29
- The Future of Continuous Integration in GNOME
- Colin Walters, Germán Poo-Caamaño, and Daniel M. German - Red Hat, USA; University of Victoria, Canada 33.
- Notes:
- Description based on online resource; title from PDF title page (IEEE, viewed April 24, 2023).
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