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2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Physical Description:
- 1 online resource
- Other Title:
- 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Microsystems, Packaging, Assembly and Circuits Technology Conference
- Place of Publication:
- Piscataway, NJ : IEEE, 2014.
- Summary:
- To reflect the cutting edges technology development, the theme of IMPACT 2014 highlights Challenge for Change Shaping the Future and will arrange keynote speeches, invited talks, industrial sessions and outstanding paper presentations The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 1-4799-7727-6
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