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2013 IEEE International 3D Systems Integration Conference (3DIC) : 2-4 Oct. 2013, San Francisco, CA / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Integrated circuits--Design and construction.
- Integrated circuits.
- Three-dimensional imaging.
- Physical Description:
- 1 online resource
- Other Title:
- 2013 IEEE International 3D Systems Integration Conference
- 3D Systems Integration Conference
- Place of Publication:
- Piscataway, NJ : IEEE, 2013.
- Contents:
- CCSSP 2020 Acknowledgements
- CCSSP 2020 Authors Index
- CCSSP 2020 Table of Contents
- [Copyright notice]
- CCSSP 2020 Organizing Committee
- Comparison of PWM Techniques for Modular Multilevel Converter: A Comparison Based on Different Voltage Level Waveforms
- GaN/Inx Ga1-x N/B0.01 Ga0.99 N Double Heterojunction Field Effect Transistor DH-FET for electronics power application
- Localization using UWB technology in N-LOS conditions
- Network-on-Chip Application Mapping Using Genetic Algorithm for a Complex hardware implementation of Video encoders
- Deep Random Forest for Facial Age Estimation Based on Face Images
- A Modified U-Net for Skin Lesion Segmentation
- A Comparative Study for Broken Rotor Bars Fault Detection in Induction Machine using DWT and MUSIC techniques
- Location and Vision Techniques to Control a KUKA KR6 R900 Sixx Robot Arm
- Smart Home Architecture based on LoRa Wireless Connectivity and LoRaWAN® Networking Protocol
- All-optical NOT/OR/XOR Logic Gates Based on Photonic Crystal with Low Response Time and High Contrast Ratio.
- Notes:
- Description based on publisher supplied metadata and other sources.
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