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EDAPS : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii / sponsored by the IEEE Components, Packaging and Manufacturing Technology Society.
- Format:
- Book
- Conference/Event
- Conference Name:
- Electrical Design of Advanced Packaging and Systems Symposium (2016 : Honolulu, Hawaii)
- Language:
- English
- Subjects (All):
- Electronic systems--Design and construction--Congresses.
- Electronic systems.
- Electronic packaging--Design and construction--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (221 pages)
- Place of Publication:
- New York : IEEE, 2017.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore Digital Library, viewed March 15, 2018).
- ISBN:
- 1-5090-6185-1
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