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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Sealing (Technology)--Congresses.
- Sealing (Technology).
- Three-dimensional integrated circuits--Congresses.
- Three-dimensional integrated circuits.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2017 5th International Workshop on Low Temperature Bonding for 3D Integration
- Place of Publication:
- Piscataway, New Jersey : IEEE, 2017.
- Summary:
- This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers that document new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies Their impact on the paradigm shift in the semiconductor industry along with 3D integration technologies is also of interest.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 4-904743-03-2
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