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Handbook of ion beam processing technology : principles, deposition, film modification, and synthesis / edited by Jerome J. Cuomo and Stephen M. Rossnagel, Harold R. Kaufman.

Knovel Electronics & Semiconductors Academic Available online

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Format:
Book
Contributor:
Cuomo, J. J.
Rossnagel, Stephen M.
Kaufman, Harold R.
Series:
Materials science and process technology series.
Materials science and process technology series
Language:
English
Subjects (All):
Ion implantation.
Ion bombardment--Industrial applications.
Ion bombardment.
Physical Description:
1 online resource (456 p.)
Place of Publication:
Park Ridge, N.J., U.S.A. : Noyes Publications, c1989.
Language Note:
English
Summary:
The handbook explains in plain terms why moldings shrink and warp, shows how additives and reinforcements change the picture, sets out the effect of molding process conditions, and tells why you never can have a single "correct" shrinkage value. But that's not all. The handbook shows how to alleviate the problem by careful design of the molded part and the mold and by proper material selection. It also examines computer-aided methods of forecasting shrinkage and warpage. And most important of all, the handbook gives you the data you need to work with. This is the most complete collection of shrinkage data ever made and includes an extensive compilation of hard-to-find multi-point information on how processing, part design, mold design, material and post mold treatment affect the part's final dimensions. Manufacturers'; figures for thousands of grades, along with an exhaustive search of magazines, journals, conference papers, books, web sites and brochures combine to make this a powerful resource. A lot depends on a dimensionally correct molding. Quality, speed to market, profit margins for the molder and toolmaker, the efficiency of secondary and assembly operations, reputation; all these are on the line. The Mold Shrinkage and Warpage Handbook is the book for people who have to live with shrinkage and warpage. It is the only book for people who have to commit themselves.
Contents:
""Contributors""; ""Contents""; ""1 Perspective on Past, Present and Future Uses of Ion Beam Technology""; ""Part I Ion Beam Technology""; ""2 Gridded Broad-Beam Ion Sources""; ""3 ECR Ion Sources""; ""4 Hall Effect Ion Sources""; ""5 Ionized Cluster Beam (ICB) Deposition and Epitaxy""; ""Part II Sputtering Phenomena""; ""6 Quantitative Sputtering""; ""7 Laser-Induced Fluorescence as a Tool for the Study of Ion Beam Sputtering""; ""8 Characterization of Atoms Desorbed from Surfaces by Ion Bombardment Using Multiphoton Ionization Detection""
""9 The Application of Postionization for Sputtering Studies and Surface or Thin Film Analysis""""Part III Film Modificaton and Synthesis""; ""10 The Modification of Films by Ion Bombardment""; ""11 Control of Film Properties by lon-Assisted Deposition Using Broad Beam Sources""; ""12 Etching wiith Directed Beams""; ""13 Film Growth Modification by Concurrent Ion Bombardment: Theory and Simulation""; ""14 Interface Structure and Thin Film Adhesion""; ""15 Modification of Thin Films by Off-Normal Incidence Ion Bornbardment""; ""16 Ion Beam Interactions with Pollymer Surfaces""
""17 Topography: Texturing Effects""""18 Methods and Techniques of Ion Beam Processes""; ""19 lon-Assisted Dielectric and Optical Coatings""; ""20 Diamond and Diamond-like Thin Films by Ion Beam Techniques""; ""Index""
Notes:
Includes index.
Includes bibliographical references.
ISBN:
1-282-00273-2
9786612002731
0-8155-1757-2

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