Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / by James J. Licari and Leonard R. Enlow.

Format:

Book

Author/Creator:

Licari, James J., 1930-

Contributor:

Enlow, Leonard R.

Series:

Materials science and process technology series. Electronic materials and process technology.

Materials science and process technology series

Language:

English

Subjects (All):

Hybrid integrated circuits--Design and construction--Handbooks, manuals, etc.

Hybrid integrated circuits.

Integrated circuits--Design and construction--Handbooks, manuals, etc.

Integrated circuits.

Physical Description:

1 online resource (603 p.)

Edition:

2nd ed.

Place of Publication:

Westwood, N.J. : Noyes Publications, c1998.

Language Note:

English

Summary:

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will

Contents:

Front Cover; Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production; Copyright Page; Contents; Chapter 1. Introduction; 1.0 CLASSIFICATION OF MATERIALS FOR MICROELECTRONICS; 2.0 CLASSIFICATION OF PROCESSES; 3.0 DEFINITION AND CHARACTERISTICS OF HYBRID CIRCUITS; 4.0 APPLICATIONS; REFERENCES; Chapter 2. Substrates; 1.0 FUNCTIONS; 2.0 SURFACE CHARACTERISTICS; 3.0 ALUMINA SUBSTRATES; 4.0 BERYLLIA SUBSTRATES; 5.0 ALUMINUM NITRIDE; 6.0 METAL MATRIX COMPOSITES; 7.0 CERAMIC SUBSTRATE MANUFACTURE; 8.0 ENAMELED METAL SUBSTRATES

9.0 QUALITY ASSURANCE AND TEST METHODSREFERENCES; Chapter 3. Thin Film Processes; 1.0 DEPOSITION PROCESSES; 2.0 THIN FILM RESISTOR PROCESSES; 3.0 PHOTORESIST MATERIALS AND PROCESSES; 4.0 ETCHING MATERIALS AND PROCESSES; 5.0 THIN-FILM MICROBRIDGE CROSSOVER CIRCUITS; REFERENCES; Chapter 4. Thick Film Processes; 1.0 FABRICATION PROCESSES; 2.0 DIRECT WRITING; 3.0 PASTE MATERIALS; 4.0 NON-NOBLE-METAL THICK FILMS; 5.0 POLYMER THICK FILMS; REFERENCES; Chapter 5. Resistor Trimming; 1.0 LASER TRIMMING; 2.0 ABRASIVE TRIMMING; 3.0 RESISTOR PROBING/MEASUREMENT TECHNIQUES; 4.0 TYPES OF RESISTOR TRIMS

5.0 SPECIAL REQUIREMENTSREFERENCES; Chapter 6. Parts Selection; 1.0 GENERAL CONSIDERATIONS; 2.0 PACKAGES; 3.0 ACTIVE DEVICES; 4.0 PASSIVE DEVICES; REFERENCES; Chapter 7. Assembly Processes; 1.0 INTRODUCTION; 2.0 DIE AND SUBSTRATE ATTACHMENT; 3.0 INTERCONNECTIONS; 4.0 CLEANING; 5.0 PARTICLE IMMOBILIZING COATINGS; 6.0 VACUUM-BARING AND SEALING; REFERENCES; Chapter 8. Testing; 1.0 ELECTRICAL TESTING; 2.0 VISUAL INSPECTION; 3.0 NONDESTRUCTIVE SCREEN TESTS; 4.0 DESTRUCTIVE SCREEN TESTS; REFERENCES; Chapter 9. Handling and Clean Rooms; 1.0 HANDLING OF HYBRID CIRCUITS AND COMPONENTS

2.0 ELECTROSTATIC DISCHARGEREFERENCES; Chapter 10. Design Guidelines; 1.0 HYBRID MICROCIRCUIT DESIGN TRANSMITTAL; 2.0 SYSTEM REQUIREMENTS AFFECTING HYBRID CIRCUIT DESIGN; 3.0 MATERIAL AND PROCESS SELECTION; 4.0 QUALITY ASSURANCE PROVISIONS; 5.0 HYBRID DESIGN PROCESS; 6.0 SUBSTRATE PARASITICS; 7.0 THERMAL CONSIDERATIONS; 8.0 LAYOUT GUIDELINES COMMON TO BOTH THICK - AND THIN-FILM HYBRIDS; 9.0 GUIDE TO HIGH-PERFORMANCE HYBRID/MCM/PACKAGE DESIGN; 10.0 EQUATIONS; 11.0 CROSS-TALK; 12.0 SIGNAL LINE CAPACITANCE; 13.0 SIGNAL-LINE INDUCTANCE; 14.0 MICROSTRIP PROPAGATION DELAY

15.0 TYPICAL MATERIAL THICKNESSES16.0 THICK-FILM MATERIALS AND PROCESSES DESCRIPTION; 17.0 THICK-FILM DESIGN GUIDELINES; 18.0 THIN-FILM GUIDELINES; REFERENCES; Chapter 11. Documentation and Specifications; 1.0 DOCUMENTATION; 2.0 MILITARY AND GOVERNMENT SPECIFICATIONS; REFERENCES; Chapter 12. Failure Analysis; 1.0 TYPES AND CAUSES OF HYBRID FAILURES; 2.0 FAILURE ANALYSIS TECHNIQUES; 3.0 ANALYTICAL TECHNIQUES; 4.0 CAUSES OF HYBRID CIRCUIT FAILURES; 5.0 CASE HISTORIES OF HYBRID CIRCUIT FAILURES; REFERENCES; Chapter 13. Multichip Modules: A New Breed of Hybrid Microcircuits; 1.0 APPLICATIONS

2.0 INTERCONNECT SUBSTRATE DESIGNS AND FABRICATION METHODS

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

1-282-71173-3

9786612711732

9786612011047

0-08-094659-3

1-59124-255-X

OCLC:

437108074