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Electromigration in thin films and electronic devices : materials and reliability / edited by Choong-Un Kim.
- Format:
- Book
- Series:
- Woodhead Publishing Series in Electronic and Optical Materials
- Language:
- English
- Subjects (All):
- Integrated circuits--Deterioration.
- Integrated circuits.
- Electrodiffusion.
- Thin films.
- Interconnects (Integrated circuit technology).
- Physical Description:
- 1 online resource (353 p.)
- Edition:
- 1st edition
- Place of Publication:
- Oxford ; Philadelphia : Woodhead Pub., c2011.
- Language Note:
- English
- System Details:
- text file
- Summary:
- Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, includin
- Contents:
- Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang
- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa
- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
- Notes:
- Description based upon print version of record.
- Includes bibliographical references and index.
- ISBN:
- 9780857093752
- 0857093754
- OCLC:
- 867318358
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